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Effect of temperature on microstructure, properties and sliding wear behavior of low alloy wear-resistant martensitic steel
Wear ( IF 5.3 ) Pub Date : 2020-02-01 , DOI: 10.1016/j.wear.2019.203125
Chengru Li , Xiangtao Deng , Long Huang , Ye Jia , Zhaodong Wang

Abstract Low alloy wear-resistant martensitic steels are increasingly prevalent in moderate-to-high temperature applications in machinery. In this study, the reciprocating sliding wear behavior of a designed low alloy martensitic steel (herein called HTP) against silicon nitride has been investigated within the temperature range of 300–500 °C and compared to similar results for another wear-resistant steel (NM400). A commercial high temperature friction and wear tester was used. The evolution of the microstructure and properties of HTP and their influence on the wear process was investigated as a function of temperature. Results have shown that as the tempering temperature was increased to 500 °C, the wear depth was significantly reduced. This is attributed to increasing the strength and hardness by 25%. As a result, high temperature wear resistance of the HTP was increased by a factor of 1.7 times relative to alloy NM400. By delaying the decrease of dislocation density and carbide precipitation during the tempering of the martensite, the transformation of microstructure from tempered martensite to tempered sorbite could be hindered, thereby improving the thermal strength of the HTP alloy's matrix. The material removal mechanisms was observed to change from fatigue spalling and abrasive wear to oxidative wear and plastic deformation when the temperature was increased from 300 °C to 500 °C.

中文翻译:

温度对低合金耐磨马氏体钢组织、性能及滑动磨损行为的影响

摘要 低合金耐磨马氏体钢在机械中的中高温应用中越来越普遍。在这项研究中,设计的低合金马氏体钢(此处称为 HTP)在 300-500 °C 的温度范围内对氮化硅的往复滑动磨损行为进行了研究,并与另一种耐磨钢(NM400 )。使用商用高温摩擦磨损试验机。作为温度的函数,研究了 HTP 的微观结构和性能的演变及其对磨损过程的影响。结果表明,随着回火温度升高到 500°C,磨损深度显着降低。这归因于将强度和硬度提高了 25%。因此,HTP 的高温耐磨性相对于合金 NM400 提高了 1.7 倍。通过延缓马氏体回火过程中位错密度的下降和碳化物析出,可以阻碍组织从回火马氏体向回火索氏体的转变,从而提高HTP合金基体的热强度。当温度从 300 °C 增加到 500 °C 时,观察到材料去除机制从疲劳剥落和磨料磨损转变为氧化磨损和塑性变形。可以阻碍回火马氏体组织向回火索氏体的转变,从而提高HTP合金基体的热强度。当温度从 300 °C 增加到 500 °C 时,观察到材料去除机制从疲劳剥落和磨料磨损转变为氧化磨损和塑性变形。可以阻碍回火马氏体组织向回火索氏体的转变,从而提高HTP合金基体的热强度。当温度从 300 °C 增加到 500 °C 时,观察到材料去除机制从疲劳剥落和磨料磨损转变为氧化磨损和塑性变形。
更新日期:2020-02-01
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