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Fused Bithiophene Imide Oligomer and Diketopyrrolopyrrole Copolymers for n-Type Thin-Film Transistors.
Macromolecular Rapid Communications ( IF 4.2 ) Pub Date : 2019-11-08 , DOI: 10.1002/marc.201900394
Yujie Zhang 1, 2 , Linjing Tang 2 , Huiliang Sun 2 , Shaohua Ling 2 , Kun Yang 2 , Mohammad Afsar Uddin 3 , Han Guo 2 , Yumin Tang 2 , Yang Wang 2 , Kui Feng 2 , Yongqiang Shi 2 , Juqing Liu 1 , Shiming Zhang 1 , Han Young Woo 4 , Xugang Guo 2
Affiliation  

Diketopyrrolopyrrole (DPP)-based copolymers have received considerable attention as promising semiconducting materials for high-performance organic thin-film transistors (OTFTs). However, these polymers typically exhibit p-type or ambipolar charge-transporting characteristics in OTFTs due to their high-lying highest occupied molecular orbital (HOMO) energy levels. In this work, a new series of DPP-based n-type polymers have been developed by incorporating fused bithiophene imide oligomers (BTIn) into DPP polymers. The resulting copolymers BTIn-DPP show narrow band gaps as low as 1.27 eV and gradually down-shifted frontier molecular orbital energy levels upon the increment of imide group number. Benefiting from the coplanar backbone conformation, well-delocalized π-system, and favorable polymer chain packing, the optimal polymer in the series shows promising n-type charge transport with an electron mobility up to 0.48 cm2 V-1 s-1 in OTFTs, which is among the highest values for the DPP-based n-type polymers reported to date. The results demonstrate that incorporating fused bithiophene imide oligomers into polymers can serve as a promising strategy for constructing high-performance n-type polymeric semiconductors.

中文翻译:

用于n型薄膜晶体管的熔融联噻吩酰亚胺低聚物和二酮吡咯并吡咯共聚物。

基于二酮吡咯并吡咯(DPP)的共聚物作为高性能有机薄膜晶体管(OTFT)的有前途的半导体材料受到了广泛的关注。但是,由于这些聚合物的最高占据分子轨道(HOMO)的能级很高,因此它们通常在OTFT中显示p型或双极性电荷传输特性。在这项工作中,通过将稠合的联噻吩酰亚胺酰亚胺低聚物(BTIn)掺入DPP聚合物中,开发了一系列新的基于DPP的n型聚合物。所得共聚物BTIn-DPP显示出低至1.27eV的窄带隙,并且随着酰亚胺基团数目的增加而逐渐降低边界分子轨道的能级。得益于共面主链构象,高度离域的π系统和良好的聚合物链堆积,该系列中的最佳聚合物显示出有希望的n型电荷传输,在OTFT中电​​子迁移率高达0.48 cm2 V-1 s-1,这是迄今为止报道的基于DPP的n型聚合物的最高值。结果表明,将稠合的联噻吩酰亚胺酰亚胺低聚物掺入聚合物中可作为构建高性能n型聚合物半导体的有前途的策略。
更新日期:2019-11-08
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