Selective seed layer patterning of PVD metal stacks by electrochemical screen printing for solar cell applications,Progress in Photovoltaics

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Selective seed layer patterning of PVD metal stacks by electrochemical screen printing for solar cell applications
Progress in Photovoltaics ( IF 8.0 ) Pub Date : 2019-11-06 , DOI: 10.1002/pip.3206
Katharina Gensowski ₁ , Mathias Kamp ₁ , Raphael Efinger ₁ , Gabriele Mikolasch ₁ , Jonas Eckert ₁ , Sebastian Bechmann ₂ , Ralf Weber ₂ , Jonas Bartsch ₁

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A proof of principle for electrochemical screen printing (ESP) as a patterning process for thin metal stacks that can be employed, eg, in interdigitated back contact (IBC) or silicon heterojunction (SHJ) solar cells, is demonstrated. By using the ESP process, a 125 × 125‐mm² interdigitated back contact grid was successfully patterned into a 100‐nm physical vapor deposited (PVD) aluminum layer. Optimizations of the ESP process were performed to improve the patterning resolution. Rectangular trenches with a mean width of 36 ± 5 μm could be demonstrated on a 100‐nm–thick aluminum layer. Up to now, ESP can be applied to PVD aluminum, copper, or stacks of both materials. Finally, metal stacks of aluminum and copper were structured, which allow a more homogeneous current distribution for the ESP process and additionally for the subsequent copper electroplating because of the second metal layer underneath the layer to be structured. The successful transfer from wafer substrate to polymer foils increases the application options of ESP technology enormously, where the topography of the surface to be structured affects the printing results.

中文翻译：

通过电化学丝网印刷对太阳能电池应用进行PVD金属堆叠的选择性种子层构图

证明了电化学丝网印刷（ESP）作为薄金属叠层的构图工艺的原理证明，该薄金属叠层可用于例如叉指背接触（IBC）或硅异质结（SHJ）太阳能电池。通过使用ESP工艺，可实现125×125-mm ²叉指式背面接触栅格已成功地图案化为100纳米物理气相沉积（PVD）铝层。对ESP工艺进行了优化，以提高图案分辨率。在100 nm厚的铝层上可以显示出平均宽度为36±5μm的矩形沟槽。到目前为止，ESP可以应用于PVD铝，铜或两种材料的堆叠。最后，对铝和铜的金属叠层进行结构化，由于在要结构化的层下面有第二金属层，因此可以为ESP工艺以及后续的电镀铜提供更均匀的电流分布。从晶圆基板成功转移到聚合物箔的成功应用极大地增加了ESP技术的应用范围，

更新日期：2019-11-06

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