当前位置: X-MOL 学术J. Compos. Mater. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Dielectric analysis as a low-complexity methodology for tracking prepreg out-time and its effects on the curing cycle
Journal of Composite Materials ( IF 2.3 ) Pub Date : 2019-05-29 , DOI: 10.1177/0021998319853325
Olivia de Andrade Raponi 1, 2 , Bárbara Righetti de Souza 1 , José Everardo Baldo Junior 2 , Antonio Carlos Ancelotti Junior 1 , Alessandro Guimarães 2
Affiliation  

The final properties of advanced composite parts manufactured from prepregs are strongly dependent on the combination of raw materials' properties and manufacturing parameters. Therefore, monitoring techniques that can characterize the prepreg cure advancement and the effects of this advancement on the curing process are of great interest to composite industries. In the present work, dielectric analyses were performed using a previously developed simple and low-cost device, as a successful alternative to track prepreg out-time and the specificities of aged prepregs curing process. The findings point out that, despite the temperature and humidity influence in the measurements, models for estimating prepreg out-times can be developed based on dielectric analyses results. Also, the dielectric properties can signalize the necessity of cure parameters adjustments, which might lead to the extension of prepreg out-time limits without significant detriment to the performance of the final part.

中文翻译:

介电分析作为一种低复杂度方法,用于跟踪预浸料超时时间及其对固化周期的影响

由预浸料制成的高级复合材料部件的最终性能在很大程度上取决于原材料的性能和制造参数的组合。因此,能够表征预浸料固化进展以及这种进展对固化过程的影响的监测技术对复合材料行业非常感兴趣。在目前的工作中,使用先前开发的简单且低成本的设备进行介电分析,作为跟踪预浸料超时时间和老化预浸料​​固化过程的特性的成功替代方案。研究结果指出,尽管测量中存在温度和湿度影响,但可以根据介电分析结果开发用于估计预浸料超时时间的模型。还,
更新日期:2019-05-29
down
wechat
bug