Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device, represents an important antenna and packaging technology achievement in recent years. AiP technology has been widely adopted by chipmakers for 60-GHz radios and gesture radars. It has also found applications in 77-GHz automotive radars, 94-GHz phased arrays, 122-GHz imaging sensors, and 300-GHz wireless links. It is believed that AiP technology will also provide elegant antenna and packaging solutions to the fifth generation and beyond operating in the lower millimeter-wave (mmWave) bands. Thus, one can conclude that AiP technology has emerged as the mainstream antenna and packaging technology for various mmWave applications. This article will provide an overview of the development of AiP technology. It will consider antennas, packages, and interconnects for AiP technology. It will show that the antenna choice is usually based on those popular antennas that can be easily designed for the application, that the package choice is governed for automatic assembly, and that the materials and processes choices involve tradeoffs among constraints, such as electrical performance, thermal–mechanical reliability, compactness, manufacturability, and cost. This article also shows a probe-based setup to measure mmWave AiP impedance and radiation characteristics. It goes on to give AiP examples implemented, respectively, in a low-temperature co-fired ceramic, an embedded wafer level ball grid array process, and a high-density interconnect processes. Finally, this article will summarize and present some recommendations on research topics to further the state of the art of AiP technology.

中文翻译：

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高度集成无线设备天线封装技术发展概述

天线封装技术（Antenna-in-Package，AiP）是指在标准的表面贴装器件中带有一个（或多个）收发器管芯的天线（或多个天线），代表了近年来一项重要的天线和封装技术成果。AiP 技术已被芯片制造商广泛用于 60 GHz 无线电和手势雷达。它还在 77 GHz 汽车雷达、94 GHz 相控阵、122 GHz 成像传感器和 300 GHz 无线链路中找到了应用。相信 AiP 技术还将为在较低毫米波 (mmWave) 频段中运行的第五代及以后提供优雅的天线和封装解决方案。因此，可以得出结论，AiP 技术已成为各种毫米波应用的主流天线和封装技术。本文将概述 AiP 技术的发展。它将考虑用于 AiP 技术的天线、封装和互连。它将表明天线选择通常基于那些可以轻松为应用设计的流行天线，封装选择受自动组装控制，材料和工艺选择涉及约束之间的权衡，例如电气性能、热机械可靠性、紧凑性、可制造性和成本。本文还展示了一种基于探头的设置，用于测量毫米波 AiP 阻抗和辐射特性。接着给出了分别在低温共烧陶瓷、嵌入式晶圆级球栅阵列工艺和高密度互连工艺中实现的 AiP 示例。最后，