当前位置: X-MOL 学术Nat. Electron. › 论文详情
Three-dimensional imaging of integrated circuits with macro- to nanoscale zoom
Nature Electronics ( IF 27.500 ) Pub Date : 2019-10-07 , DOI: 10.1038/s41928-019-0309-z
Mirko Holler, Michal Odstrcil, Manuel Guizar-Sicairos, Maxime Lebugle, Elisabeth Müller, Simone Finizio, Gemma Tinti, Christian David, Joshua Zusman, Walter Unglaub, Oliver Bunk, Jörg Raabe, A. F. J. Levi, Gabriel Aeppli

The imaging of integrated circuits across different length scales is required for failure analysis, design validation and quality control. At present, such inspection is accomplished using a hierarchy of different probes, from optical microscopy on the millimetre length scale to electron microscopy on the nanometre scale. Here we show that ptychographic X-ray laminography can provide non-destructive, three-dimensional views of integrated circuits, yielding both images of an entire chip volume and high-resolution images of arbitrarily chosen subregions. We demonstrate the approach using chips produced with 16 nm fin field-effect transistor technology, achieving a reconstruction resolution of 18.9 nm, and compare our results with photolithographic mask layout files and more conventional imaging approaches such as scanning electron microscopy. The technique should also be applicable to other branches of science and engineering where three-dimensional X-ray images of planar samples are required.

更新日期:2019-10-07

 

全部期刊列表>>
物理学研究前沿热点精选期刊推荐
chemistry
自然职位线上招聘会
欢迎报名注册2020量子在线大会
化学领域亟待解决的问题
材料学研究精选新
GIANT
ACS ES&T Engineering
ACS ES&T Water
ACS Publications填问卷
屿渡论文,编辑服务
阿拉丁试剂right
南昌大学
王辉
南方科技大学
彭小水
隐藏1h前已浏览文章
课题组网站
新版X-MOL期刊搜索和高级搜索功能介绍
ACS材料视界
天合科研
x-mol收录
赵延川
李霄羽
廖矿标
朱守非
试剂库存
down
wechat
bug