Mold has a strong impact on the corrosion behavior of metals, especially under environmental conditions conducive to mold growth. However, the magnetic fields generated by electronic devices have effects on the metal corrosion and mold growth. In this study, a 10 mT static magnetic field (SMF) perpendicular to the surface of samples was applied to study the corrosion of a copper-clad printed circuit board (PCB-Cu) by mold under the SMF. Based on the analysis of the corrosion morphology of the PCB-Cu after a test in the atmosphere and the composition of the corrosion products, the corrosion behavior of mold on the PCB-Cu in the presence or absence of the SMF was revealed. In the absence of a magnetic field, mold formed a spore-centered corrosion pit group on the surface of the PCB-Cu, which was macroscopically characterized by regional uniform corrosion. When a 10 mT SMF was applied, the magnetic field exhibited an inhibitory effect on the growth of mold, which was hindered, and the corrosion of the PCB-Cu surface slowed down.

中文翻译：

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静磁场对印刷电路板模具腐蚀的影响。

霉菌对金属的腐蚀行为有很大影响，尤其是在有利于霉菌生长的环境条件下。但是，电子设备产生的磁场会影响金属腐蚀和霉菌的生长。在这项研究中，垂直于样品表面的10 mT静磁场（SMF）用于研究在SMF下模具对覆铜印刷电路板（PCB-Cu）的腐蚀。根据在大气中测试后PCB-Cu的腐蚀形态和腐蚀产物的组成分析，揭示了存在或不存在SMF时模具在PCB-Cu上的腐蚀行为。在没有磁场的情况下，模具在PCB-Cu的表面形成了一个以孢子为中心的腐蚀坑组，宏观上以局部均匀腐蚀为特征。当施加10 mT SMF时，磁场对模具的生长表现出抑制作用，这被阻止，并且PCB-Cu表面的腐蚀减慢了。