Film capacitors with high energy storage are becoming particularly important with the development of advanced electronic and electrical power systems. Polymer-based materials have stood out from other materials and have become the main dielectrics in film capacitors because of their flexibility, cost-effectiveness, and tailorable functional properties. A core issue for achieving films with high performance is to process a material with high dielectric permittivity and breakdown strength but low dielectric loss. Nanocomposites and all-polymer dielectrics are two promising avenues to address this issue. Thus, in this work, the advances of the past decade are highlighted to reflect the latest developments in polymer-based film dielectrics. The key factors of dielectric properties, including polarization mechanisms, dielectric breakdown strength, filler–matrix interface, and hierarchical structures are discussed in detail. A comprehensive understanding of the fabrication of polymer-based materials with special constituents, molecular segments, and microstructures will provide guidance to engineers on the fabrication of polymer-based materials with high performance.

随着先进的电子和电力系统的发展，具有高能量存储的薄膜电容器变得尤为重要。聚合物基材料因其柔韧性，成本效益和可定制的功能特性而在其他材料中脱颖而出，并已成为薄膜电容器中的主要电介质。获得高性能薄膜的核心问题是处理介电常数和击穿强度高但介电损耗低的材料。纳米复合材料和全聚合物电介质是解决该问题的两个有希望的途径。因此，在这项工作中，强调了过去十年的进步，以反映基于聚合物的薄膜电介质的最新发展。介电性能的关键因素包括极化机理，介电击穿强度，填充矩阵的接口和层次结构进行了详细讨论。对具有特殊成分，分子链段和微结构的聚合物基材料的制造的全面理解，将为工程师提供高性能聚合物基材料的制造提供指导。