Abstract

Sophisticated three-dimensional (3D) forms are expected to be one of the significant development trends in next-generation microelectronics because of their capabilities of rendering substantially enhanced performances, a high degree of integration, and novel functionalities. To date, a diversity of manufacturing methods has been developed for 3D microelectronic devices with different structural and functional features. Most of these methods fall into two categories, i.e., micromanufacturing technologies and mechanically guided 3D assembly approaches. From this perspective, we review the different manufacturing methods and their specific features as well as their limitations. At present, there is still no universal method that can deterministically form 3D microelectronic devices with very high geometric complexity and nanoscale precision. We offer an outlook on future developments in the manufacturing of 3D multifunctional microelectronics devices and provide some perspectives on the remaining challenges as well as possible solutions. Mechanically guided 3D assembly based on compressive buckling is proposed as a versatile platform that can be merged with micromanufacturing technologies and/or other assembly methods to provide access to microelectronic devices with more types of integrated functions and highly increased densities of functional components.

中文翻译：

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3D多功能微电子设备的制造：挑战与机遇

抽象的

复杂的三维（3D）形式有望成为下一代微电子技术的重要发展趋势之一，因为它们具有显着提高性能，高度集成和新颖功能的能力。迄今为止，已经为具有不同结构和功能特征的3D微电子设备开发了多种制造方法。这些方法中的大多数可分为两类，即微制造技术和机械引导的3D组装方法。从这个角度出发，我们回顾了不同的制造方法及其特定功能及其局限性。目前，还没有通用的方法可以确定性地形成具有非常高的几何复杂度和纳米级精度的3D微电子器件。我们对3D多功能微电子设备制造的未来发展进行了展望，并就剩余的挑战以及可能的解决方案提供了一些观点。提出了基于压缩屈曲的机械引导3D组装作为一种通用平台，可以与微制造技术和/或其他组装方法合并，以提供对具有更多类型的集成功能和功能部件密度大大提高的微电子设备的访问。