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Research on the machinability of A-plane sapphire under diamond wire sawing in different sawing directions
Ceramics International ( IF 5.2 ) Pub Date : 2019-06-01 , DOI: 10.1016/j.ceramint.2019.02.086
Ningchang Wang , Feng Jiang , Xipeng Xu , Nian Duan , Qiuling Wen , Xizhao Lu

Abstract Due to its superior mechanical, optical and chemical properties, sapphire (α-Al2O3) is widely used in engineering, optics, medicine, and other scientific research fields. The atomic structure of sapphire gives rise to anisotropy in its mechanical properties, which affects the machinability of sapphire materials on different crystal planes. Different cutting directions will affect the wafer economy and surface quality achieved during wire sawing due to this anisotropy. In this study, the machinability of A-plane sapphire was investigated for diamond wire sawing in three different directions, following the C-plane, R-plane and M-plane. The results show that the direction following the M-plane could be the best direction for diamond wire sawing because this direction results in the minimal sawing forces, the lowest specific energy and the smallest volume of material that will need to be removed during subsequent processing. These characteristics correspond to the direction with the highest fracture strength since the material is removed by brittle machining. The force ratio for sawing in the direction of the R-plane is the smallest because this direction is associated with the minimum hardness and the lowest critical load for the transition from plastic to brittle removal of the workpiece material. The 3D height parameters show no obvious pattern among the three sawing directions. The mechanism of material removal is mainly brittle removal, with some plastic removal, and is obviously affected by the crystal orientation.

中文翻译:

不同锯切方向金刚石线锯下A面蓝宝石的可加工性研究

摘要 蓝宝石(α-Al2O3)由于其优越的机械、光学和化学性能,被广泛应用于工程、光学、医学等科学研究领域。蓝宝石的原子结构导致其机械性能的各向异性,这影响了蓝宝石材料在不同晶面上的可加工性。由于这种各向异性,不同的切割方向将影响线锯过程中实现的晶片经济性和表面质量。在这项研究中,在 C 面、R 面和 M 面之后的三个不同方向上研究了 A 面蓝宝石的可加工性,用于金刚石线锯。结果表明,遵循 M 平面的方向可能是金刚石线锯的最佳方向,因为该方向导致最小的锯切力,在后续加工过程中需要去除的最低比能和最小体积的材料。这些特性对应于断裂强度最高的方向,因为材料是通过脆性加工去除的。在 R 平面方向上锯切的力比最小,因为该方向与工件材料从塑性到脆性去除过渡的最低硬度和最低临界载荷相关。3D 高度参数在三个锯切方向之间没有显示出明显的模式。材料去除的机理主要是脆性去除,也有一些塑性去除,受晶体取向的影响明显。这些特性对应于断裂强度最高的方向,因为材料是通过脆性加工去除的。在 R 平面方向上锯切的力比最小,因为该方向与工件材料从塑性到脆性去除过渡的最小硬度和最低临界载荷相关。3D 高度参数在三个锯切方向之间没有显示出明显的模式。材料去除的机理主要是脆性去除,也有一定的塑性去除,明显受晶体取向的影响。这些特性对应于断裂强度最高的方向,因为材料是通过脆性加工去除的。在 R 平面方向上锯切的力比最小,因为该方向与工件材料从塑性到脆性去除过渡的最低硬度和最低临界载荷相关。3D 高度参数在三个锯切方向之间没有显示出明显的模式。材料去除的机理主要是脆性去除,也有一定的塑性去除,明显受晶体取向的影响。在 R 平面方向上锯切的力比最小,因为该方向与工件材料从塑性到脆性去除过渡的最低硬度和最低临界载荷相关。3D 高度参数在三个锯切方向之间没有显示出明显的模式。材料去除的机理主要是脆性去除,也有一定的塑性去除,明显受晶体取向的影响。在 R 平面方向上锯切的力比最小,因为该方向与工件材料从塑性到脆性去除过渡的最低硬度和最低临界载荷相关。3D 高度参数在三个锯切方向之间没有显示出明显的模式。材料去除的机理主要是脆性去除,也有一定的塑性去除,明显受晶体取向的影响。
更新日期:2019-06-01
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