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Recent Progress in Micro‐Supercapacitors with In‐Plane Interdigital Electrode Architecture
Small ( IF 13.3 ) Pub Date : 2017-10-04 , DOI: 10.1002/smll.201701989
Nishuang Liu 1 , Yihua Gao 1
Affiliation  

Due to the boom of miniaturized electronic devices in the last decade, there are great demands for ultrathin and flexible on‐chip rechargeable energy storage microdevices. Supercapacitor, as one of the most hopeful appearing energy storage devices, can provide a wonderful alternative to batteries or electrolytic capacitors, owing to its fast charge and discharge rates, high power density, and long cycling stability. Especially for the recently developed micro‐supercapacitors, the unique in‐plane interdigital electrode architecture can fully meet the integration requirements of rapidly developed miniaturized electronic devices, and improve the power density of the unit via shortening the ionic diffusion distance between the interdigital electrodes. This concept introduces the recent advances on the design, fabrication, and application of planar micro‐supercapacitors for on‐chip energy storage from an overall perspective. Moreover, challenges and future development trends are discussed.

中文翻译:

具有平面叉指式电极架构的微型超级电容器的最新进展

由于近十年来小型电子设备的兴起,人们对超薄且灵活的片上可充电储能微型设备提出了很高的要求。超级电容器作为最有希望出现的储能设备之一,由于其快速的充电和放电速率,高的功率密度和长的循环稳定性,因此可以替代电池或电解电容器。特别是对于最近开发的微型超级电容器,独特的平面内叉指式电极架构可以完全满足快速发展的小型电子设备的集成要求,并通过缩短叉指式电极之间的离子扩散距离来提高单元的功率密度。这个概念介绍了设计,制造,从整体上看,平面微型超级电容器在片上能量存储中的应用和应用。此外,还讨论了挑战和未来的发展趋势。
更新日期:2017-10-04
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