Abstract The essential functionality of photonic and electronic devices is contained in thin surface layers leaving the substrate often to play primarily a mechanical role. Layer transfer of optimised devices or materials and their heterogeneous integration is thus a very attractive strategy to realise high performance, low-cost circuits for a wide variety of new applications. Additionally, new device configurations can be achieved that could not otherwise be realised. A range of layer transfer methods have been developed over the years including epitaxial lift-off and wafer bonding with substrate removal. Recently, a new technique called transfer printing has been introduced which allows manipulation of small and thin materials along with devices on a massively parallel scale with micron scale placement accuracies to a wide choice of substrates such as silicon, glass, ceramic, metal and polymer. Thus, the co-integration of electronics with photonic devices made from compound semiconductors, silicon, polymer and new 2D materials is now achievable in a practical and scalable method. This is leading to exciting possibilities in microassembly. We review some of the recent developments in layer transfer and particularly the use of the transfer print technology for enabling active photonic devices on rigid and flexible foreign substrates.

中文翻译：

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用于光子组件异构集成的转移印刷技术

摘要 光子和电子器件的基本功能包含在薄表面层中，而基板通常主要起机械作用。因此，优化设备或材料的层转移及其异构集成是实现高性能、低成本电路的一种非常有吸引力的策略，适用于各种新应用。此外，可以实现原本无法实现的新设备配置。多年来已经开发了一系列层转移方法，包括外延剥离和带有衬底去除的晶片键合。最近，引入了一种称为转移印刷的新技术，该技术允许在大规模平行尺度上对小而薄的材料以及设备进行操作，以微米级的放置精度对硅、玻璃、陶瓷、金属和聚合物等多种基材进行操作。因此，电子器件与由化合物半导体、硅、聚合物和新型二维材料制成的光子器件的协同集成现在可以通过一种实用且可扩展的方法实现。这为微组装带来了令人兴奋的可能性。我们回顾了层转移方面的一些最新进展，特别是转移印刷技术在刚性和柔性外来基板上启用有源光子器件的使用。电子器件与由化合物半导体、硅、聚合物和新型 2D 材料制成的光子器件的协同集成现在可以通过一种实用且可扩展的方法实现。这为微组装带来了令人兴奋的可能性。我们回顾了层转移方面的一些最新进展，特别是转移印刷技术在刚性和柔性外来基板上启用有源光子器件的使用。电子器件与由化合物半导体、硅、聚合物和新型 2D 材料制成的光子器件的协同集成现在可以通过一种实用且可扩展的方法实现。这为微组装带来了令人兴奋的可能性。我们回顾了层转移方面的一些最新进展，特别是转移印刷技术在刚性和柔性外来基板上启用有源光子器件的使用。