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Full-field internal 3D deformations measurement of transparent soil using 3D-DIC combined with optical slicing
Acta Geotechnica ( IF 5.7 ) Pub Date : 2024-02-23 , DOI: 10.1007/s11440-024-02275-2
Longyong Tong , Hang Zhou , Brian Sheil , Hanlong Liu , Ronglin Chen

Digital image correlation (DIC) and particle image velocity (PIV) are highly effective non-contact methods to accurately measure full-field deformations in transparent soil model testing (TSMT). The nature of transparent soils combined with the rapid development of three-dimensional (3D) DIC/PIV techniques means that the acquisition of the full internal 3D deformations is now technically feasible. However, current approaches focus on two-dimensional (2D) in-plane displacements and typically ignore out-of-plane displacements. This paper presents an approach of combining 3D-DIC with optical slicing to observe 3D movements of transparent soil using custom MATLAB programming. A rigid body motion (RBM) test of a transparent soil sample is first conducted to estimate the accuracy of the proposed algorithm. A vertically loaded circular footing test is subsequently performed as a proof of concept; multiple-slice images of the soil are captured using a new experimental apparatus and processed by the 3D-DIC algorithm, and the resultant 3D displacements of all slices are reconstructed to visualize the soil deformations in 3D space. The findings confirm that the proposed 3D-DIC algorithm is accurate and the optical slicing with supplementary spatial reconstruction method enables visualization of transparent soil in 3D space, which can be used in future TSMT.



中文翻译:

利用 3D-DIC 结合光学切片对透明土壤进行全场内部 3D 变形测量

数字图像相关 (DIC) 和粒子图像速度 (PIV) 是精确测量透明土模型测试 (TSMT) 中全场变形的高效非接触方法。透明土壤的性质与三维 (3D) DIC/PIV 技术的快速发展相结合,意味着获取完整的内部 3D 变形现在在技术上是可行的。然而,当前的方法关注二维(2D)面内位移,并且通常忽略面外位移。本文提出了一种将 3D-DIC 与光学切片相结合的方法,以使用自定义 MATLAB 编程来观察透明土壤的 3D 运动。首先对透明土壤样本进行刚体运动(RBM)测试,以评估所提出算法的准确性。随后进行垂直加载的圆形基础测试作为概念验证;使用新的实验装置捕获土壤的多切片图像,并通过 3D-DIC 算法进行处理,并重建所有切片的 3D 位移,以可视化 3D 空间中的土壤变形。研究结果证实,所提出的 3D-DIC 算法是准确的,并且光学切片和补充空间重建方法可以实现 3D 空间中透明土壤的可视化,可用于未来的 TSMT。

更新日期:2024-02-23
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