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A facile method to prepare biobased flexible polydimethylsiloxane − Benzoxazine resin: Dielectric properties and high heat resistance
Reactive & Functional Polymers ( IF 5.1 ) Pub Date : 2024-01-11 , DOI: 10.1016/j.reactfunctpolym.2024.105832
Xin-Long Sha , Xiu-Zhi Yang , Suping Fang , Zheng Li , Pengfan Li , Zongtang Liu , Zheng-hao Fei

For the benefit of meet the industrial demand of integrated circuits for low dielectric constant (k) and the environmental requirements of sustainable development, it is important to prepare biobased benzoxazine resin with low k and high heat resistance by solvent-free method. In this paper, the biobased monomer V-fa containing aldehyde group was synthesized by biobased raw materials furfurylamine and vanillin, and then reacted with amino-terminated polydimethylsiloxane (PDMS) to prepare benzoxazine monomer V-fa-pdms containing schiff base structure by a solvent-free method. Then, the monomer was cured to obtain biobased benzoxazine resin poly(V-fa-pdms), and the heat resistance, mechanical and dielectric properties of poly(V-fa-pdms) were studied. The results indicate that the resin exhibits excellent thermal stability and toughness by combining benzoxazine and PDMS reasonably. The initial thermal decomposition temperature (Tdi, 5% thermogravimetric loss) is 387 °C, and the material also exhibits excellent dielectric properties. When the frequency increases from 1 Hz to 1 MHz, the k of the material decreases from 2.71 to 2.60, and the fluctuation range of dielectric loss is 0.0051–0.0049. With the increase of frequency, both k and dielectric loss show a downward trend. At the same time, the material shows good corrosion resistance in commonly used solvents. These excellent properties of poly(V-fa-pdms) are due to the existence of a high cross-linked network structure formed by multiple cross-linking sites in the polymer network and the combined effect of low k and high heat-resistant PDMS components.



中文翻译:

一种制备生物基柔性聚二甲基硅氧烷的简便方法 - 苯并恶嗪树脂:介电性能和高耐热性

为了满足集成电路工业对低介电常数( k )的需求和可持续发展的环境要求,采用无溶剂法制备低介电常数、高耐热性的生物基苯并恶嗪树脂具有重要意义。本文以生物基原料糠胺和香草醛合成含醛基的生物基单体V-fa ,然后与氨基封端的聚二甲基硅氧烷(PDMS)通过溶剂反应制备含希夫碱结构的苯并恶嗪单体V-fa-pdms -免费方法。然后将单体固化得到生物基苯并恶嗪树脂聚(V-fa-pdms) ,并对聚(V-fa-pdms)的耐热性、力学性能和介电性能进行研究。结果表明,苯并恶嗪与PDMS合理组合,树脂表现出优异的热稳定性和韧性。初始热分解温度(T di,5%热重损失)为387℃,材料还表现出优异的介电性能。当频率从1 Hz增加到1 MHz时,材料的k从2.71减小到2.60,介电损耗波动范围为0.0051~0.0049。随着频率的增加,k和介电损耗均呈现下降趋势。同时,该材料在常用溶剂中表现出良好的耐腐蚀性。聚(V-fa-pdms)的这些优异性能得益于聚合物网络中多个交联位点形成的高交联网络结构的存在以及低k和高耐热PDMS组分的共同作用。

更新日期:2024-01-11
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