ABSTRACT

Efficient chip cooling has become particularly important with the rapid development of high heat flux electronic chips. In this study, a cooling system for electronic chips using dry ice as the cooling medium is developed. The combination of jet impingement and phase change sublimation was employed to achieve efficient cooling by utilizing the Joule-Thomson effect to generate dry ice. The impact of the ratio of heatsink height to inlet diameter (H/D) and dry ice jet velocity on the heat transfer characteristics of the heatsink is investigated by theoretical calculations and experimental tests. The results showed that the optimal heat transfer coefficient was achieved when H/D was 4, 12.76% to 43.28% higher than other H/D values. The chip temperature could be maintained below 38.69°C, which was 8.79% to 36.62% lower than other H/D values, and the heat flux reached 428.92W/cm². The chip temperature could be effectively regulated by controlling the dry ice flow rate. Furthermore, a comparison with other cooling methods indicated that the dry ice jet cooling system was more suitable for cooling high heat flux electronic devices. The research findings laid the foundation for dry ice cooling of high heat flux chips.

摘要

随着高热通量电子芯片的快速发展，高效的芯片冷却变得尤为重要。在这项研究中，开发了一种使用干冰作为冷却介质的电子芯片冷却系统。喷射冲击和相变升华相结合，利用焦耳-汤姆逊效应产生干冰，实现高效冷却。通过理论计算和实验测试，研究了散热器高度与入口直径之比（ H/D）和干冰喷射速度对散热器传热特性的影响。结果表明，当H/D为4时，传热系数达到最佳，比其他H/D高12.76%~43.28%价值观。芯片温度可维持在38.69℃以下，比其他H/D值低8.79%~36.62% ，热通量达到428.92W/cm ²。通过控制干冰流量可以有效调节芯片温度。此外，与其他冷却方法的比较表明，干冰喷射冷却系统更适合冷却高热通量电子设备。研究成果为高热通量芯片的干冰冷却奠定了基础。