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Vertically Aligned Boron Nitride Nanosheets Films for Superior Electronic Cooling
ACS Applied Materials & Interfaces ( IF 8.3 ) Pub Date : 2023-06-02 , DOI: 10.1021/acsami.3c04126
Kai Yang 1 , Xiaoran Yang 1 , Zexin Liu 2 , Kangyong Li 1 , Yue Yue 2 , Rong Zhang 1 , Fanfan Wang 1 , Xiaojie Shi 3 , Jun Yuan 4 , Ningyu Liu 4 , Gongkai Wang 5 , Zhiqiang Wang 3 , Guoqing Xin 1
Affiliation  

Thermally conductive and electrically insulating thermal interface materials (TIMs) are highly desired for electronic cooling. To improve heat transfer efficiency, thermally conductive fillers with a high loading content have been incorporated into the polymer-based TIMs. However, this is usually at the expense of the interfacial thermal resistance reduction and reliability. In this study, vertically aligned boron nitride nanosheet films (VBNFs) have been prepared by a scalable microfluidic spinning process and template-assisted chemical vapor deposition conversion method. A further high-temperature annealing was applied to achieve high crystallinity. VBNFs have been applied as fillers to fabricate TIMs and achieve a superior through-plane thermal conductivity of 6.4 W m–1 K–1 and low modulus of 2.2 MPa at low BN loading of 9.85 vol %, benefitting from the well-aligned vertical sheet structure and high crystallinity. In addition, the fabricated TIMs present high-volume resistivity and breakdown strength, satisfying the electrical insulation demands. The high thermal conductivity and low modulus contribute an outstanding cooling performance to the TIMs in the heat dissipation application for high-power LEDs. This template-assisted conversion technology for the fabrication of orientated BN nanosheets structure and the prepared high-performance TIMs pave the way for efficient thermal management of high-power electronics.

中文翻译:

用于卓越电子冷却的垂直排列的氮化硼纳米片薄膜

电子冷却非常需要导热和电绝缘的热界面材料 (TIM)。为了提高传热效率,聚合物基 TIM 中加入了高负载量的导热填料。然而,这通常是以界面热阻降低和可靠性为代价的。在这项研究中,垂直排列的氮化硼纳米片薄膜 (VBNFs) 是通过可扩展的微流控纺丝工艺和模板辅助化学气相沉积转化方法制备的。应用进一步的高温退火以获得高结晶度。VBNF 已被用作填料来制造 TIM,并实现了 6.4 W m –1 K –1的优异的平面导热率在 9.85 vol % 的低 BN 负载下,模量低至 2.2 MPa,这得益于排列良好的垂直片状结构和高结晶度。此外,制造的 TIM 具有高体积电阻率和击穿强度,满足电绝缘要求。高导热性和低模量为大功率 LED 散热应用中的 TIM 提供了出色的冷却性能。这种用于制造定向 BN 纳米片结构的模板辅助转换技术和制备的高性能 TIM 为高功率电子产品的高效热管理铺平了道路。
更新日期:2023-06-02
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