Precipitation-strengthened Cu alloys with high strength and conductivity (HSC) has become widespread in the electronic and electrical industries. Although pure Cu exhibits high electrical and thermal conductivity, its strength is insufficient. Thus, the primary objective of developing Cu alloys with HSC is to substantially enhance their strength while retaining high electrical conductivity (EC). This review provides an overview of the research progress on typical precipitation-strengthened Cu-Ni-Si, Cu-Ti and Cu-Cr-Zr alloys, as well as the strengthening mechanisms employed. In particular, we discuss hetero-deformation induced (HDI) hardening, the construction and effect of heterogenous structure in Cu alloys, and how the trade-off between strength, ductility, and EC can be better addressed by constructing a coupling distribution of hard and soft domains in alloys. Moreover, based on the precipitation strengthening mechanism, we calculate the Orowan contribution of two uniform ideal distributions of disc-like shape δ-Ni₂Si phases, and propose an outlook. Notably, controlling the growth of phases to achieve maximum strength contribution is a key research breakthrough. Additionally, the development of Cu alloys with HSC must consider large-scale industrialization and production costs.

具有高强度和导电性（HSC）的沉淀强化铜合金已在电子和电气工业中得到广泛应用。尽管纯 Cu 具有高导电性和导热性，但其强度不足。因此，开发具有 HSC 的 Cu 合金的主要目标是在保持高导电性 (EC) 的同时显着提高其强度。本文综述了典型沉淀强化 Cu-Ni-Si、Cu-Ti 和 Cu-Cr-Zr 合金的研究进展及其强化机制。特别是，我们讨论了异质变形诱导 (HDI) 硬化、Cu 合金中异质结构的构造和影响，以及强度、延展性、和 EC 可以通过构建合金中硬域和软域的耦合分布来更好地解决。此外，基于析出强化机制，我们计算了两个均匀理想分布的盘状δ-Ni的Orowan贡献₂ Si 阶段，并提出展望。值得注意的是，控制相的生长以实现最大的强度贡献是一项关键的研究突破。此外，开发具有HSC的Cu合金必须考虑大规模工业化和生产成本。