High-power insulated gate bipolar transistor (IGBT) modules are the key devices for energy change and transmission. Reflow soldering process is a crucial process in IGBT module packaging manufacture. Residual stress and warpage of IGBT modules are induced after soldering, which can lead to degradation of device performance and working life. Combining frame-based baseplate and the key material properties of AlSiC at different temperatures, latent heat and viscoplastic intrinsic models of the solder, this study established a finite element (FE) model of the reflow soldering process of IGBT modules to predict the warpage and residual stresses. Reflow soldering experiments of IGBT modules were conducted to examine the shape of the lower surface of the baseplate before and after the soldering process, and are used to verify the modeling results. The model shows a good agreement with the experimental with an error of 5.46%. The FE model will contribute to the optimization of reflow soldering process and package structure of IGBT module.

大功率绝缘栅双极晶体管（IGBT）模块是能量转换和传输的关键器件。回流焊工艺是IGBT模块封装制造中的关键工艺。IGBT 模块在焊接后会产生残余应力和翘曲，这会导致器件性能和工作寿命下降。本研究结合基于框架的基板和 AlSiC 在不同温度下的关键材料特性、焊料的潜热和粘塑性本征模型，建立了 IGBT 模块回流焊过程的有限元 (FE) 模型，以预测翘曲和残留讲。对 IGBT 模块进行了回流焊实验，以检查焊接过程前后基板下表面的形状，并用于验证建模结果。该模型与实验结果吻合良好，误差为 5.46%。FE模型将有助于优化IGBT模块的回流焊工艺和封装结构。