More recently, transient liquid phase bonding was widely considered to be a potential bonding method in 3D-IC technology as the full intermetallic compounds (IMCs) joints were characterized by superior bonding strength and reliable high temperature service. Nevertheless, preferred grain orientation and coarsening grains have been the shortcoming for traditional Cu/Sn/Cu transient liquid-phase bumps in heterogeneous integration. To alleviate such issues, Ni/Sn/Cu system was adopted to improve mechanical properties. Moreover, the thickness of joints was reduced to 5 μm for staying ahead of the trends of the miniaturization of electronic products. In this research, the microstructure of Cu/Sn-3.0Ag-0.5Cu/Cu, Cu/Sn-3.0Ag-0.5Cu/Ni, and Ni/Sn-3.0Ag-0.5Cu/Cu micro-bumps after transient liquid-phase bonding was investigated. With dissolution of Ni from substrate, the intermetallic compounds have diverse texture and refined grain. The distinct correlation between intermetallic compounds structure and Ni content was investigated on Ni substrate being in hot end or cold end. After shear testing, as compared to Cu/Sn-3.0Ag-0.5Cu/Cu, Ni/Sn-3.0Ag-0.5Cu/Cu showed extremely outstanding strength via replacing Cu substrate by Ni substrate. As compared to conventional Cu/solder/Cu full intermetallic structure, the shear strength increased 103.28% as Ni at the cold end. In this study, microstructure, grain analysis, and the fracture path observation after shear test were carried out to clarify the strengthening mechanisms of Ni.

最近，瞬态液相键合被广泛认为是 3D-IC 技术中一种潜在的键合方法，因为全金属间化合物 (IMC) 接头具有出色的键合强度和可靠的高温服务。然而，优选的晶粒取向和粗化晶粒一直是异质集成中传统 Cu/Sn/Cu 瞬态液相凸块的缺点。为了缓解这些问题，采用 Ni/Sn/Cu 系统来提高机械性能。此外，接缝厚度降至5μm，领先电子产品小型化趋势。在本研究中，Cu/Sn-3.0Ag-0.5Cu/Cu、Cu/Sn-3.0Ag-0.5Cu/Ni和Ni/Sn-3.0Ag-0.5Cu/Cu微凸块在瞬态液化后的显微结构-相结合进行了研究。随着Ni从基体中溶解，金属间化合物具有不同的织构和细化的晶粒。在处于热端或冷端的镍基板上研究了金属间化合物结构与镍含量之间的明显相关性。经过剪切测试，与Cu/Sn-3.0Ag-0.5Cu/Cu相比，Ni/Sn-3.0Ag-0.5Cu/Cu通过将Cu基体替换为Ni基体而表现出极其出色的强度。与传统的Cu/焊料/Cu全金属间结构相比，冷端剪切强度以Ni计提高了103.28%。在这项研究中，进行了显微组织、晶粒分析和剪切试验后的断裂路径观察，以阐明 Ni 的强化机制。在处于热端或冷端的镍基板上研究了金属间化合物结构与镍含量之间的明显相关性。经过剪切测试，与Cu/Sn-3.0Ag-0.5Cu/Cu相比，Ni/Sn-3.0Ag-0.5Cu/Cu通过将Cu基体替换为Ni基体而表现出极其出色的强度。与传统的Cu/焊料/Cu全金属间结构相比，冷端剪切强度以Ni计提高了103.28%。在这项研究中，进行了显微组织、晶粒分析和剪切试验后的断裂路径观察，以阐明 Ni 的强化机制。在处于热端或冷端的镍基板上研究了金属间化合物结构与镍含量之间的明显相关性。经过剪切测试，与Cu/Sn-3.0Ag-0.5Cu/Cu相比，Ni/Sn-3.0Ag-0.5Cu/Cu通过将Cu基体替换为Ni基体而表现出极其出色的强度。与传统的Cu/焊料/Cu全金属间结构相比，冷端剪切强度以Ni计提高了103.28%。在这项研究中，进行了显微组织、晶粒分析和剪切试验后的断裂路径观察，以阐明 Ni 的强化机制。与传统的Cu/焊料/Cu全金属间结构相比，冷端剪切强度以Ni计提高了103.28%。在这项研究中，进行了显微组织、晶粒分析和剪切试验后的断裂路径观察，以阐明 Ni 的强化机制。与传统的Cu/焊料/Cu全金属间结构相比，冷端剪切强度以Ni计提高了103.28%。在这项研究中，进行了显微组织、晶粒分析和剪切试验后的断裂路径观察，以阐明 Ni 的强化机制。