Graphite/Cu bonding is essential for the fabrication of graphite-based plasma-facing parts and graphite-type commutators. Transient liquid phase bonding of graphite/Cu has been conducted separately with Ti/Cu/Ti and Ti/Cu/Ni/Ti multi-foils. The interfacial microstructure and mechanical properties of the bonded joints have been characterized. For the joint with Ti/Cu/Ti multi-foils, complete melting of the Ti/Cu/Ti multi-foils and interdiffusion between the molten zone and the Cu substrate occur during the bonding process, leading to formation of Ti–Cu intermetallics in the bonding area. The liquid phase flowing toward the sidewall of the Cu substrate gives rise to a thickness of the bonding area far less than those of the as-received multi-foils. For the joint with Ti/Cu/Ni/Ti multi-foils, the bonding area can be divided into three parts (areas I, II and III). The bonding areas I and III comprise Ti–Cu intermetallics and Ti(Cu_xNi_1-x)₂, while the bonding area II consists of an Ni layer and two thin TiNi₃ reaction layers. The thickness of the whole bonding area is similar to those of the as-received multi-foils, indicating that addition of Ni foil can prevent the loss of liquid phase zone by inhibiting the excessive liquid phase formation. The addition of a Ni foil in bonding of the graphite/Cu may alleviate the joint residual stress by its intermediate coefficient of thermal expansion (CTE) to accommodate any thermal mismatch in the joint and by its superior ductility and plasticity, thus resulting in shear strength promotion of the joint with the Ti/Cu/Ni/Ti multi-foils by approximately 35% when compared to the Ti/Cu/Ti multi-foils.

石墨/铜键合对于制造基于石墨的面向等离子体的部件和石墨型换向器至关重要。石墨/Cu 的瞬时液相键合分别与 Ti/Cu/Ti 和 Ti/Cu/Ni/Ti 多层箔进行了结合。已对粘合接头的界面微观结构和力学性能进行了表征。对于与 Ti/Cu/Ti 多层箔的连接，Ti/Cu/Ti 多层箔的完全熔化和熔融区与 Cu 基体之间的相互扩散在键合过程中发生，导致 Ti-Cu 金属间化合物的形成粘合区域。流向 Cu 基板侧壁的液相导致键合区域的厚度远小于原始多箔的厚度。对于 Ti/Cu/Ni/Ti 多层箔的连接，连接区域可分为三个部分（区域 I，二和三）。结合区域 I 和 III 包括 Ti-Cu 金属间化合物和 Ti(Cu_x Ni _1-x ) ₂，而结合区II由一层Ni层和两层薄的TiNi ₃反应层组成。整个粘合区域的厚度与原始多箔的厚度相似，表明添加镍箔可以通过抑制过多的液相形成来防止液相区的损失。在石墨/铜的结合中添加镍箔可以通过其中间热膨胀系数 (CTE) 减轻接头残余应力，以适应接头中的任何热失配，并通过其优异的延展性和塑性，从而提高剪切强度与 Ti/Cu/Ti 多箔片相比，Ti/Cu/Ni/Ti 多箔片的接头提升了约 35%。