Conductive adhesive tape is one kind of electromagnetic interference (EMI) shielding materials for electronic packaging. However, the inferior conductivity of the pressure-sensitive adhesive (PSA) layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects. Adding conductive fillers is a traditional method for highly conductive adhesive tapes. However, the content of conductive fillers is needed to reach the percolation threshold, which is usually as high as tens of percent. High-content fillers result in significant loss of adhesive property and high fabrication cost. Herein, we introduce a rational architecture of conductive microsphere monolayer (CMM) in the PSA layer. The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction. Importantly, low contents of conductive microspheres (≤5 % (mass fraction, w)) can achieve the target of conductivity improvement, but not result in the serious loss of the adhesive property. Therefore, the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes. Finally, we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes, indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.

导电胶带是一种用于电子封装的电磁干扰（EMI）屏蔽材料。然而，压敏胶（PSA）层的导电性较差，导致导电胶带与目标物体之间的连接处存在严重的电磁泄漏。添加导电填料是高导电胶带的传统方法。然而，导电填料的含量需要达到渗透阈值，通常高达百分之几十。高含量填料会导致粘合性能的显着损失和高制造成本。在此，我们介绍了 PSA 层中导电微球单层 (CMM) 的合理结构。CMM 连接 PSA 层的顶面和底面并提高其导电性z方向。重要的是，低含量的导电微球（≤5%（质量分数，w））可以达到提高导电性的目标，但不会导致粘合性能的严重损失。因此，CMM 的策略可以平衡导电 PSA 胶带的导电性和粘合性能之间的权衡。最后，我们展示了成品导电胶带卓越的 EMI 屏蔽性能，表明它们作为先进的 EMI 屏蔽材料在电子封装中的潜在应用。