Under ultrasonication, cuprous oxide (Cu₂O) microparticles (<5 µm) were fragmented into nanoparticles (NPs, ranging from 10 to 30 nm in diameter), and interacted strongly with alkali lignin (Mw = 10 kDa) to form a nanocomposite. The ultrasonic wave generates strong binding interaction between lignin and Cu₂O. The L-Cu nanocomposite exhibited synergistic effects with enhanced antibiofilm activities against E. coli, multidrug-resistant (MDR) E. coli, S. aureus (SA), methicillin-resistant SA, and P. aeruginosa (PA). The lignin-Cu₂O (L-Cu) nanocomposite also imparted notable eradication of such bacterial biofilms. Experimental evidence unraveled the destruction of bacterial cell walls by L-Cu, which interacted strongly with the bacterial membrane. After exposure to L-Cu, the bacterial cells lost the integrated structural morphology. The estimated MIC for biofilm inhibition for the five tested pathogens was 1 mg/mL L-Cu (92 % lignin and 8 % Cu₂ONPs, w/w %). The MIC for bacterial eradication was noticeably lower; 0.3 mg/mL (87 % lignin + 13 % Cu₂ONPs, w/w %) for PA and SA, whereas this value was appreciably higher for MDR E. coli (0.56 mg/mL, 86 % lignin and 14 % Cu₂O NPs). Such results highlighted the potential of L-Cu as an alternative to neutralize MDR pathogens.

在超声处理下，氧化亚铜 (Cu ₂ O) 微粒 (<5 µm) 破碎成纳米颗粒（NP，直径范围为 10 至 30 nm），并与碱木质素 (Mw = 10 kDa) 强烈相互作用，形成纳米复合材料。超声波在木质素和 Cu ₂ O 之间产生强烈的结合相互作用。L-Cu 纳米复合材料表现出协同作用，增强了对大肠杆菌、多重耐药 (MDR)大肠杆菌、金黄色葡萄球菌(SA) 、甲氧西林-耐药 SA和铜绿假单胞菌( PA)。木质素-Cu ₂O (L-Cu) 纳米复合材料还可以显着根除此类细菌生物膜。实验证据揭示了 L-Cu 对细菌细胞壁的破坏，L-Cu 与细菌膜相互作用强烈。暴露于 L-Cu 后，细菌细胞失去了完整的结构形态。五种测试病原体的生物膜抑制估计 MIC 为 1 mg/mL L-Cu（92% 木质素和 8% Cu ₂ ONPs，w/w%）。细菌根除的 MIC 明显较低；0.3 mg/mL（87 % 木质素 + 13 % Cu ₂ ONPs，w/w %）用于 PA 和 SA，而该值对于 MDR大肠杆菌（0.56 mg/mL，86 % 木质素和 14 % Cu ₂O NP)。这些结果突出了 L-Cu 作为中和 MDR 病原体的替代品的潜力。