A method for modeling the interconnection and signal transmission performance of double bond ribbons with configuration variation has been proposed. Arc interval function parameterization has been used to define the geometry of bond ribbons. The coupling model was created using the equivalent circuit approach, taking into account the mutual coupling between two ribbons. The average relative error of return loss is 9.21%, and the average relative error of insertion loss is 0.23%. The accuracy of the model has been verified, and the envelope interval of the signal transmission performance considering the variation of the interconnection configuration has been calculated.

中文翻译：

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电子封装中双键带互连变化的基于等效电路的耦合建模

已经提出了一种对具有配置变化的双键带的互连和信号传输性能进行建模的方法。弧区间函数参数化已用于定义键合带的几何形状。耦合模型是使用等效电路方法创建的，同时考虑了两个带之间的相互耦合。回波损耗的平均相对误差为9.21%，插入损耗的平均相对误差为0.23%。验证了模型的准确性，计算了考虑互连配置变化的信号传输性能包络区间。