当前位置：
X-MOL 学术
›
Mater. Sci. Eng. A
›
论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Realizing high-strength diffusion bonding of copper at ultra-low temperatures via single point diamond turning and spark plasma sintering
Materials Science and Engineering: A ( IF 6.4 ) Pub Date : 2022-09-29 , DOI: 10.1016/j.msea.2022.144116 Wendi Li , Yuxin Liang , Yang Bai , Tiesong Lin , Bangsheng Li , Zhiqiang Fu , Jicai Feng
中文翻译：
通过单点金刚石车削和放电等离子烧结实现超低温铜的高强度扩散键合
更新日期：2022-10-03
Materials Science and Engineering: A ( IF 6.4 ) Pub Date : 2022-09-29 , DOI: 10.1016/j.msea.2022.144116 Wendi Li , Yuxin Liang , Yang Bai , Tiesong Lin , Bangsheng Li , Zhiqiang Fu , Jicai Feng
Single point diamond turning (SPDT) could produce nanoscale surface roughness and surface nanograins. When subsequently heated by spark plasma sintering (SPS), the SPDT processed copper realized diffusion bonding at an ultra-low temperature of ∼202 °C (0.35 Tm). Finally, high-strength (∼269 MPa) diffusion bonding of copper was achieved via SPDT and SPS.
中文翻译：
通过单点金刚石车削和放电等离子烧结实现超低温铜的高强度扩散键合
单点金刚石车削 (SPDT) 可以产生纳米级表面粗糙度和表面纳米晶粒。当随后通过放电等离子烧结 (SPS) 加热时，SPDT 处理的铜在~202 °C (0.35 T m )的超低温下实现了扩散键合。最后，通过 SPDT 和 SPS 实现了铜的高强度（~269 MPa）扩散键合。
京公网安备 11010802027423号