The as-drawn equiatomic TiZrV medium-entropy alloy (MEA) has a diphasic heterostructure, and exhibits great potential for structural applications. The as-drawn TiZrV MEA is composed of two phases of the TiZr and TiV with body-centered cubic (BCC) structure, which mainly exist in the form of elongated grains with an average grain size of about 70 μm. A small amount of the two phases embedded in each other's coarse grains in the form of submicron second phase particles, forming a diphasic heterostructure. The yield strength and compression ratio of the specimen subjected to thrice impacts can reach 1410 MPa and 39%, respectively, at a strain rate of 1100 s⁻¹ and room temperature. After thrice impacts, about 3.5% by volume of the TiZr was observed to be uniformly distributed in the coarse grains of TiV phase in the form of second phase particles of about 43 nm. Precipitation strengthening and high-density dislocation strengthening based on its heterostructure are the main reasons for the improvement of mechanical properties of the TiZrV MEA. The average grain size of the outer and inner regions of the shear band formed by localized shear stress in the cylindrical specimen of TiZrV MEA is about 3.4 and 43 μm, respectively. The TiZr and TiV are embedded in each other's coarse grains in the form of second-phase particles of about 35 and 175 nm, respectively, within the shear band. The rotational dynamic recrystallization (RDR) mechanism can simulate the process of ultra-fine grains in the shear band. The diphasic heterostructure in the shear band may be formed by the intergranular rotation of the grains under the action of shear stress.

拉制的等原子TiZrV中熵合金（MEA）具有双相异质结构，在结构应用中表现出巨大的潜力。拉制的TiZrV MEA由TiZr和TiV两相组成，具有体心立方（BCC）结构，主要以平均晶粒尺寸约70μm的细长晶粒形式存在。少量的两相以亚微米第二相颗粒的形式嵌入彼此的粗晶粒中，形成双相异质结构。^{在1100 s -1}的应变速率下，三次冲击试样的屈服强度和压缩比分别可以达到1410 MPa和39%和室温。在三次撞击后，观察到约 3.5% 体积的 TiZr 以约 43 nm 的第二相颗粒的形式均匀分布在 TiV 相的粗晶粒中。基于其异质结构的析出强化和高密度位错强化是TiZrV MEA机械性能提高的主要原因。TiZrV MEA圆柱形试样中由局部剪切应力形成的剪切带的外部和内部区域的平均晶粒尺寸分别约为3.4和43 μm。TiZr 和 TiV 在剪切带内分别以约 35 和 175 nm 的第二相颗粒的形式嵌入彼此的粗晶粒中。旋转动态再结晶（RDR）机制可以模拟剪切带中超细晶粒的过程。