This study investigated the power cycling performance on a transfer-molded power module with Cu clip bonding for the next-generation green automotive applications. A 700 V/900A class 2-in-1 half bridge power module was designed and fabricated by using Cu clip bonding and transfer-molding technologies. The switching was precisely controlled so that t_on was 0.5 s and t_off was 4.5 s by a constant current mode. The condition of the power cycling tests (PCTs) was ∆T = 125 °C with the maximum repetition of 97,000 cycles. The performance and life of the power module was evaluated based on AQG-324, and thermal resistance of the junction (R_th-ja) was monitored during PCTs. The major failure in this investigation was increase in the thermal resistance (R_th). Microstructural integrity of the interconnections were characterized in detail by scanning acoustic tomography (SAT) and interfacial microstructure analysis using a scanning electron microscopy (SEM). The degradation mechanism of the interfacial material was numerically revealed through finite element method (FEM) simulations.

本研究调查了用于下一代绿色汽车应用的带有铜夹键合的传递模塑功率模块的功率循环性能。采用铜夹键合和传递成型技术设计制造了 700 V/900A 类二合一半桥功率模块。通过恒流模式精确控制开关，使 t _on为 0.5 s，t _{off为 4.5 s。}功率循环测试 (PCT) 的条件是ΔT  = 125 °C，最大重复次数为 97,000 次。功率模块的性能和寿命基于AQG-324评估，结热阻（R _th-ja) 在 PCT 期间受到监控。该研究的主要失败是热阻（R _th）的增加。通过扫描声学断层扫描 (SAT) 和使用扫描电子显微镜 (SEM) 的界面微观结构分析详细表征了互连的微观结构完整性。通过有限元法 (FEM) 模拟数值揭示了界面材料的降解机制。