New method for measuring the key parameters for electronic components during drop testing on board-level has been developed. The equipment presented in this paper is capable of simultaneous measurements for acceleration, strain, and continuous resistance in-situ during the drop event. The results presented in this study show that compared to the traditional simple comparator-type-of approach with event detectors, this new measurement setup can provide a combined information of component actual resistance and board strain values during the drop. This makes it possible for more rigorous analysis of the stress factors causing the failure events during the drop test.

中文翻译：

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电气元件跌落试验中板级应力分析新方法

开发了在板级跌落测试期间测量电子元件关键参数的新方法。本文介绍的设备能够在跌落过程中同时现场测量加速度、应变和连续电阻。本研究中提供的结果表明，与带有事件检测器的传统简单比较器类型的方法相比，这种新的测量设置可以提供跌落期间组件实际电阻和电路板应变值的组合信息。这使得在跌落测试期间对导致故障事件的应力因素进行更严格的分析成为可能。