This paper focuses on the thermomechanical behaviour and the consecutive damage of the bond-wire contacts in power semiconductors. Electro-thermal-mechanical finite element analysis of power cycle loads was used to model realistic transient temperature loadings as well as mechanical stresses. Mechanical damage modelling using the cohesive zone approach was used in conjunction with coupled finite element analysis. Parallel to the theoretical research, a pulse width modulation power cycling test bench was realized, and thermal cycles tests were carried out on power modules with temperature swing ∆T_j = 30^°C and minimal temperature T_{j, min} = 55^°C. Electron Back Scatter Diffraction was used to investigate crack early-stage crack propagation and crack propagation of the samples. Fatigue cracks were found to be always initiated from the interface wire –metallization and propagate exactly at the contact.

本文重点研究功率半导体中键合线触点的热机械行为和连续损坏。动力循环负载的电热机械有限元分析用于模拟实际瞬态温度负载以及机械应力。使用内聚区方法的机械损伤建模与耦合有限元分析结合使用。^{在理论研究的同时，实现了脉宽调制功率循环试验台，对温度}摆幅_ΔTj  =30 ^℃、最低温度Tj _{, min =}  55 ℃的功率模块进行热循环试验. 电子背散射衍射用于研究裂纹早期裂纹扩展和样品的裂纹扩展。疲劳裂纹被发现总是从界面线金属化开始并准确地在接触处传播。