Within the scope of this work, an optimization approach of existing investigations on electroplated hard gold contacts is to be developed, which have an initial Vickers hardness of 103 HV. These investigations envisage the height-controlled bonding of structures in the multichip integration of optical components. The investigations relate to the influence of material hardness and roughness on the plastic deformation behaviour during bond formation by thermocompression bonding (TCB). Furthermore, pre-treatments such as mechanical surface planarization and chemical surface activation using atmospheric pressure plasma are employed prior to the bonding process to enable the reduction of the bonding parameters pressure and temperature and consequently contribute to control the plastic deformation during thermocompression and reduce the typical plastic deformation range of 30 % to a deformation range below 5 %. The previous investigations were performed on gold contacts, which have been thermally annealed prior to the bonding process and resulted in a plastic deformation range up to 30 %. With the new approach, i.e. throughout the material hardening and altering the surface condition, a plastic deformation range below 3 % was successfully obtained. The attainable bonding temperatures and bonding pressures were between 190 °C–250 °C and 145 MPa–230 MPa, respectively. The bonding time varied between 30 s and 60 s.

在这项工作的范围内，将开发一种对现有电镀硬金触点研究的优化方法，其初始维氏硬度为 103 HV。这些研究设想了光学元件多芯片集成中结构的高度控制键合。研究涉及材料硬度和粗糙度对通过热压结合 (TCB) 形成结合过程中塑性变形行为的影响。此外，在粘合过程之前采用诸如机械表面平坦化和使用大气压等离子体的化学表面活化等预处理，以降低粘合参数压力和温度，从而有助于控制热压过程中的塑性变形并减少典型的塑性变形30 % 到 5 % 以下的变形范围。之前的研究是在金触点上进行的，这些触点在键合过程之前已经过热退火，导致塑性变形范围高达 30%。使用新方法，即在整个材料硬化和改变表面条件的过程中，成功地获得了低于 3% 的塑性变形范围。可达到的粘合温度和粘合压力分别在 190 °C–250 °C 和 145 MPa–230 MPa 之间。粘合时间在 30 秒和 60 秒之间变化。