This paper proposes an analysis for the main microstructural changes at the chip topside level in the metallic interconnections of SKIM63 IGBT power modules due to aging processes caused by power cycling. The objective is to correlate these changes with the degradation processes dominating such positions. In this study, it is deduced that grains stability drives their texture evolution upon cycling. Transformations of texture components, which indicate whether the structure is recrystallized or deformed, are analyzed at different cycling stages. Afterward, the effect of the evolution of the disorientation angle's distribution on the crack passage is discussed. The size of grains directly related to their strength was as well shown to affect the cracking manner. Finally, the cracking procedure is interpreted in detail.

本文提出了对由于功率循环引起的老化过程导致的 SKIM63 IGBT 功率模块的金属互连中芯片顶部的主要微观结构变化的分析。目的是将这些变化与主导这些位置的退化过程相关联。在这项研究中，推断晶粒稳定性驱动它们在循环时的纹理演变。在不同的循环阶段分析了织构成分的转变，表明结构是再结晶还是变形。随后，讨论了定向角分布的演变对裂纹通道的影响。与它们的强度直接相关的晶粒尺寸也被证明会影响开裂方式。最后，详细解释破解过程。