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60 GHz RF module with beam-steering optimization algorithm for high data rate access and backhaul communications
EURASIP Journal on Wireless Communications and Networking ( IF 2.3 ) Pub Date : 2022-09-24 , DOI: 10.1186/s13638-022-02176-6
Imran Aziz , Björn Franzén , Erik Öjefors , Dragos Dancila

This paper presents an 802.11ad-based radio frequency module for high data rate fixed wireless access and backhaul communications. The transceiver chip is manufactured in SiGe BiCMOS technology covering 57–71 GHz, providing 16 RX and 16 TX paths with combined output power of more than 20 dBm. The chip is packaged using embedded wafer-level BGA technology of the size \(12.6\times 12.6\times 0.8~{\text{ mm }}^3\) and employs advanced dielectric materials with 2 metallic redistribution layers. The package integrates the transceiver chip with RX and TX high gain PCB antenna arrays, allowing effective isotropic radiated power (EIRP) of more than 40 dBm. Beam steering is achieved in ± 50\(^{\circ }\) by the transceiver through providing appropriate weights to the antenna arrays. The paper presents generation of beamforming lookup table along with optimization of the power distribution to the array. This optimization results in flattening of the EIRP over the whole beam-steering range and frequency bandwidth. The module allows for data rates up to 10 Gbps by employing full-channel 128 QAM and half-channel 256 QAM single-carrier modulation.



中文翻译:

具有波束控制优化算法的 60 GHz 射频模块,用于高数据速率访问和回程通信

本文介绍了一种用于高数据速率固定无线接入和回程通信的基于 802.11ad 的射频模块。收发器芯片采用 SiGe BiCMOS 技术制造,覆盖 57–71 GHz,提供 16 条 RX 和 16 条 TX 路径,组合输出功率超过 20 dBm。该芯片采用尺寸为\(12.6\times 12.6\times 0.8~{\text{ mm }}^3\)的嵌入式晶圆级 BGA 技术进行封装,并采用具有 2 个金属再分布层的先进介电材料。该封装将收发器芯片与 RX 和 TX 高增益 PCB 天线阵列集成在一起,可实现超过 40 dBm 的有效全向辐射功率 (EIRP)。光束转向在 ± 50 \(^{\circ }\)内实现由收发器通过向天线阵列提供适当的权重。本文介绍了波束成形查找表的生成以及对阵列的功率分配的优化。这种优化导致 EIRP 在整个波束控制范围和频率带宽上变平。该模块采用全通道 128 QAM 和半通道 256 QAM 单载波调制,可实现高达 10 Gbps 的数据速率。

更新日期:2022-09-26
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