Abstract

Aging processes in the two types of temperature-sensitive Cu_0.1Ni_0.8Co_0.2Mn_1.9O₄ ceramics (two-phase and with different amount of NiO phase) as well as thick films base on Cu_0.1Ni_0.1Co_1.6Mn_1.2O₄ ceramics were investigated. It is shown for Cu_0.1Ni_0.8Co_0.2Mn_1.9O₄ ceramics prepared at 1170 °C with addition treatment at 850 °C that the post-separation process of the second phase continue under heat at temperatures of 125 and 170 °C. It has been found that higher thermal aging leads to more pronounced changes in electrical resistance. Addition temperature influences contribute to the stabilization of ceramic parameters. The aging test at 170 °C results in a 7.5% reduction in electrical resistance, while at 125 °C this value is only 6%. It is shown that NiO phase additives formed during sintering of Cu_0.1Ni_0.1Co_1.6Mn_1.2O₄ ceramics and located near the grain boundaries of ceramics inhibit the aging process in these materials. This effect is characteristic of fine-grained ceramics obtained by thermal energy converted during sintering. It is established that the kinetics of aging in Cu_0.1Ni_0.1Co_1.6Mn_1.2O₄ ceramics is described by the relaxation function of DeBast-Gillard or Williams-Watts, regardless of the composition of the ceramics. The aging kinetics in thick films based on Cu_0.1Ni_0.1Co_1.6Mn_1.2O₄ ceramics at 170 °C is also adequately described by the compression-exponential relaxation function.

摘要

两种温度敏感型 Cu _0.1 Ni _0.8 Co _0.2 Mn _1.9 O ₄陶瓷（两相和不同含量的 NiO 相）以及基于 Cu _0.1 Ni _0.1 Co _1.6 Mn _1.2 O ₄的厚膜的老化过程陶瓷进行了调查。显示为 Cu _0.1 Ni _0.8 Co _0.2 Mn _1.9 O ₄在 1170 °C 下制备的陶瓷在 850 °C 下进行附加处理，第二阶段的分离后过程在 125 和 170 °C 的温度下继续加热。已经发现，更高的热老化导致更显着的电阻变化。添加温度的影响有助于陶瓷参数的稳定。170 °C 的老化测试导致电阻降低 7.5%，而在 125 °C 时该值仅为 6%。结果表明，Cu _0.1 Ni _0.1 Co _1.6 Mn _1.2 O _{4烧结过程中形成NiO相添加剂}陶瓷和位于陶瓷晶界附近抑制这些材料的老化过程。这种效果是通过烧结过程中转换的热能获得的细晶粒陶瓷的特征。已确定，Cu _0.1 Ni _0.1 Co _1.6 Mn _1.2 O ₄陶瓷的老化动力学由 DeBast-Gillard 或 Williams-Watts 的弛豫函数描述，而与陶瓷的组成无关。压缩指数松弛函数也充分描述了基于 Cu _0.1 Ni _0.1 Co _1.6 Mn _1.2 O ₄陶瓷的厚膜在 170 °C 下的老化动力学。