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Joining of aluminum and ceramic substrates by interposing molten aluminum–silicon alloy
International Journal of Applied Ceramic Technology ( IF 1.8 ) Pub Date : 2022-08-29 , DOI: 10.1111/ijac.14198
Ken'ichiro Kita 1 , Mikinori Hotta 1
Affiliation  

The effects of interposing a molten aluminum alloy layer between pure aluminum and silicon nitride on the strength of joining and properties of the joined sample were investigated. An aluminum-based alloy containing 12 wt% silicon with a melting point lower than the 660°C melting point of pure aluminum was joined to pure aluminum and a silicon nitride substrate by using polymethylphenylsiloxane. A specimen with the same joining area (1600 mm2) and no alloy layer was prepared for comparison. In thermal cycling tests of Δ190 K, cooled at –40°C and heated at 150°C, the specimen without the alloy layer failed after 200 cycles, whereas the specimen with the alloy layer failed after 500 cycles. The bending strength of the sample with the alloy was approximately 1.5 times that of the sample without the alloy. These results indicate that the alloy layer facilitated the strong joining of the aluminum and substrate.

中文翻译:

通过插入熔融铝硅合金连接铝和陶瓷基板

研究了在纯铝和氮化硅之间插入熔融铝合金层对连接强度和连接样品性能的影响。使用聚甲基苯基硅氧烷将熔点低于纯铝 660°C 熔点的含 12 wt% 硅的铝基合金连接到纯铝和氮化硅基板上。具有相同连接面积的试样(1600 mm 2) 并且没有准备合金层用于比较。在 Δ190 K、冷却至 –40°C 和加热至 150°C 的热循环试验中,没有合金层的试样在 200 次循环后失效,而有合金层的试样在 500 次循环后失效。含有合金的样品的抗弯强度大约是不含合金的样品的1.5倍。这些结果表明合金层促进了铝和基材的牢固连接。
更新日期:2022-08-29
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