ABSTRACT

The electroless plating method is the most convenient for the metallisation of dielectrics. During this statistical study of the process, complex relationships were found between the composition of the electrolyte and the deposition regime. The complexity of this technology is an important multifactorial object of the study. An adequate linear regression model for electroless deposition of Cu-Ni-P alloy coatings was obtained by conducting a planned factorial experiment. It allows predicting the thickness of the electroless deposited alloy coating based on certain values of the input parameters (concentrations of copper sulphate, nickel sulphate and sodium hypophosphite) in the studied factor space, as well as further optimisation of the process.

摘要

化学镀方法对于电介质的金属化是最方便的。在该过程的统计研究中，发现电解质的组成与沉积状态之间存在复杂的关系。这项技术的复杂性是研究的一个重要的多因素对象。通过进行计划的因子实验，获得了用于化学镀 Cu-Ni-P 合金涂层的适当线性回归模型。它允许根据所研究的因子空间中的输入参数（硫酸铜、硫酸镍和次磷酸钠的浓度）的某些值预测化学沉积合金涂层的厚度，并进一步优化工艺。