Electronic devices with engineered three-dimensional (3D) architectures are indispensable for frictional-force sensing, wide-field optical imaging, and flow velocity measurement. Recent advances in mechanically guided assembly established deterministic routes to 3D structures in high-performance materials, through controlled rolling/folding/buckling deformations. The resulting 3D structures are, however, mostly formed on planar substrates and cannot be transferred directly onto another curved substrate. Here, we introduce an ordered assembly strategy to allow transformation of 2D thin films into sophisticated 3D structures on diverse curved surfaces. The strategy leverages predefined mechanical loadings that deform curved elastomer substrates into flat/cylindrical configurations, followed by an additional uniaxial/biaxial prestretch to drive buckling-guided assembly. Release of predefined loadings results in an ordered assembly that can be accurately captured by mechanics modeling, as illustrated by dozens of complex 3D structures assembled on curved substrates. Demonstrated applications include tunable dipole antennas, flow sensors inside a tube, and integrated electronic systems capable of conformal integration with the heart.

中文翻译：

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在曲面上组装复杂的 3D 结构和电子设备

具有工程三维 (3D) 架构的电子设备对于摩擦力传感、广域光学成像和流速测量是必不可少的。机械引导装配的最新进展通过受控的滚动/折叠/屈曲变形为高性能材料中的 3D 结构建立了确定性路线。然而，由此产生的 3D 结构大多形成在平面基板上，不能直接转移到另一个弯曲基板上。在这里，我们介绍了一种有序组装策略，以允许将 2D 薄膜转换为不同曲面上的复杂 3D 结构。该策略利用预定义的机械载荷，将弯曲的弹性体基板变形为平面/圆柱形配置，然后是额外的单轴/双轴预拉伸以驱动屈曲引导组件。释放预定义的载荷会产生有序的装配，可以通过力学建模准确捕获，如在弯曲基板上装配的数十个复杂 3D 结构所示。演示的应用包括可调谐偶极天线、管内流量传感器以及能够与心脏共形集成的集成电子系统。