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Observation of in-plane shear stress fields in off-axis SiC wafers by birefringence imaging
Journal of Applied Crystallography ( IF 5.2 ) Pub Date : 2022-07-30 , DOI: 10.1107/s1600576722006483 Shunta Harada 1 , Kenta Murayama 2
中文翻译:
通过双折射成像观察离轴 SiC 晶片的面内剪切应力场
更新日期:2022-07-30
Journal of Applied Crystallography ( IF 5.2 ) Pub Date : 2022-07-30 , DOI: 10.1107/s1600576722006483 Shunta Harada 1 , Kenta Murayama 2
Affiliation
中文翻译:
通过双折射成像观察离轴 SiC 晶片的面内剪切应力场