The recent push for the “materials by design” paradigm requires synergistic integration of scalable computation, synthesis, and characterization. Among these, techniques for efficient measurement of thermal transport can be a bottleneck limiting the experimental database size, especially for diverse materials with a range of roughness, porosity, and anisotropy. Traditional contact thermal measurements have challenges with throughput and the lack of spatially resolvable property mapping, while non-contact pump-probe laser methods generally need mirror smooth sample surfaces and also require serial raster scanning to achieve property mapping. Here, we present structured illumination with thermal imaging (SI-TI), a new thermal characterization tool based on parallelized all-optical heating and thermometry. Experiments on representative dense and porous bulk materials as well as a 3D printed thermoelectric thick film (∼50 μm) demonstrate that SI-TI (1) enables paralleled measurement of multiple regions and samples without raster scanning; (2) can dynamically adjust the heating pattern purely in software, to optimize the measurement sensitivity in different directions for anisotropic materials; and (3) can tolerate rough (∼3 μm) and scratched sample surfaces. This work highlights a new avenue in adaptivity and throughput for thermal characterization of diverse materials.

中文翻译：

---

带热成像的结构化照明 (SI-TI)：一种用于并行热传输表征的动态可重构计量学

最近推动的“材料设计”范式需要可扩展计算、合成和表征的协同集成。其中，有效测量热传输的技术可能是限制实验数据库大小的瓶颈，特别是对于具有一系列粗糙度、孔隙率和各向异性的各种材料。传统的接触式热测量在吞吐量和缺乏空间可分辨的属性映射方面存在挑战，而非接触式泵浦探针激光方法通常需要镜面光滑的样品表面，还需要串行光栅扫描来实现属性映射。在这里，我们展示了带热成像的结构化照明 (SI-TI)，这是一种基于并行全光加热和测温的新型热表征工具。对代表性致密和多孔散装材料以及 3D 打印热电厚膜（~50 μm）的实验表明，SI-TI (1) 无需光栅扫描即可对多个区域和样品进行并行测量；(2) 可以纯软件动态调整加热方式，优化各向异性材料不同方向的测量灵敏度；(3) 可以容忍粗糙 (∼3 μm) 和划伤的样品表面。这项工作突出了不同材料热表征的适应性和吞吐量的新途径。优化各向异性材料在不同方向的测量灵敏度；(3) 可以容忍粗糙 (∼3 μm) 和划伤的样品表面。这项工作突出了不同材料热表征的适应性和吞吐量的新途径。优化各向异性材料在不同方向的测量灵敏度；(3) 可以容忍粗糙 (∼3 μm) 和划伤的样品表面。这项工作突出了不同材料热表征的适应性和吞吐量的新途径。