As an intermediate layer of transient liquid bonding, Sn interconnect solder is widely used in 3D chip stack interconnection due to its lower cost and excellent wettability. This study focuses on the effect of submicron Al particles on the interfacial microstructure and properties of Sn interconnect solder. Adding submicron Al particles efficiently restrained the growth of interfacial IMC and improved the wettability and mechanical properties of Sn interconnect solder, but it has little effect on the melting characteristics. When the 0.3 wt% submicron Al particles are added into Sn interconnect solder, the spreading area, shear strength and microhardness were improved by 69.5 %, 45.6 % and 20 %, respectively. Based on the content optimization of Al particles, the microstructure evolution and bonding strength of Sn-0.3Al interconnect solder as transient liquid bonding intermediate layer at different bonding times were studied. It was found that the growth rate of IMC and the number of voids in Sn-0.3Al TLPB joints were lower than those in the Sn TLPB joints. The bonding strength of TLPB joints increased with the increase of bonding time, and the bonding strength of Sn-0.3Al TLPB joints was always higher than that of TLPB joints without submicron Al.

作为瞬态液体键合的中间层，Sn 互连焊料因其成本较低和良好的润湿性而被广泛用于 3D 芯片堆叠互连。本研究的重点是亚微米 Al 颗粒对 Sn 互连焊料的界面微观结构和性能的影响。添加亚微米级Al颗粒有效抑制了界面IMC的生长，提高了Sn互连焊料的润湿性和力学性能，但对熔融特性影响不大。当0.3 wt%的亚微米Al颗粒添加到Sn互连焊料中时，扩散面积、剪切强度和显微硬度分别提高了69.5 %、45.6 %和20 %。基于Al颗粒的含量优化，Sn-0的显微组织演变和结合强度。研究了3Al互连焊料在不同键合时间下作为瞬态液态键合中间层。结果表明，Sn-0.3Al TLPB接头中IMC的生长速率和空洞数量低于Sn TLPB接头。TLPB接头的结合强度随着结合时间的增加而增加，Sn-0.3Al TLPB接头的结合强度始终高于不含亚微米Al的TLPB接头。