Electromagnetic interference (EMI) shielding materials with low reflection and excellent thermal conduction are vitally important for sophisticated devices and next-generation communications technologies. This work offers a feasible strategy to develop multifunction absorption-dominated shielding materials by constructing layered structure with bicontinuous interpenetrating networks. Magnetic Co-C particles derived from metals metal–organic frameworks are introduced to serve as a microwave absorber that endows the system with strong absorption in the upper layer. While, low-melting-point alloys (LMPAs) at the bottom can form a perfect conductive network, providing sufficient microwave reflection for the composites. This special structure can bring a distinctive “absorb-reflect-reabsorb” process while waves penetrate into the sample, leading to a high EMI shielding effectiveness (SE) with a low power coefficient of reflectivity (R). The composites with Co-C(20 wt%) and LMPAs(30 vol%) achieves an average EMI SE of ~50 dB, while R is ~0.40. In particular, benefitting from the alloy network, the thermal conductivity of the lower layer is greatly improved from ~0.22 W/mK to ~1.50 W/mK. With integrating these remarkable features in one material, this layered structure composite might be more competitive in many application fields such as 5 G communications and green building.

具有低反射和出色导热性的电磁干扰 (EMI) 屏蔽材料对于精密设备和下一代通信技术至关重要。这项工作通过构建具有双连续互穿网络的层状结构，为开发多功能吸收为主的屏蔽材料提供了可行的策略。引入源自金属金属有机骨架的磁性 Co-C 颗粒作为微波吸收剂，使系统在上层具有强吸收。而底部的低熔点合金（LMPA）可以形成完美的导电网络，为复合材料提供足够的微波反射。这种特殊的结构可以在波穿透样品的同时带来独特的“吸收-反射-再吸收”过程，导致高 EMI 屏蔽效率 (SE) 和低功率反射率系数 (R)。具有 Co-C（20 wt%）和 LMPAs（30 vol%）的复合材料的平均 EMI SE 为 ~50 dB，而 R 为 ~0.40。特别是，受益于合金网络，下层的热导率从~0.22 W/mK大大提高到~1.50 W/mK。将这些显着特性整合在一种材料中，这种层状结构复合材料可能在5G通信、绿色建筑等诸多应用领域更具竞争力。下层的热导率从~0.22 W/mK 大大提高到~1.50 W/mK。将这些显着特性整合在一种材料中，这种层状结构复合材料可能在5G通信、绿色建筑等诸多应用领域更具竞争力。下层的热导率从~0.22 W/mK 大大提高到~1.50 W/mK。将这些显着特性整合在一种材料中，这种层状结构复合材料可能在5G通信、绿色建筑等诸多应用领域更具竞争力。