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Lego-like reconfigurable AI chips
Nature Electronics ( IF 33.7 ) Pub Date : 2022-06-16 , DOI: 10.1038/s41928-022-00785-z Shi-Jun Liang , Feng Miao
Nature Electronics ( IF 33.7 ) Pub Date : 2022-06-16 , DOI: 10.1038/s41928-022-00785-z Shi-Jun Liang , Feng Miao
A reconfigurable integration technology based on stackable chips with embedded arrays of optoelectronic devices and memristive crossbars could be of use in edge intelligence applications.
中文翻译:
类似乐高的可重构人工智能芯片
基于具有嵌入式光电器件阵列和忆阻交叉开关的可堆叠芯片的可重构集成技术可用于边缘智能应用。
更新日期:2022-06-16
中文翻译:
类似乐高的可重构人工智能芯片
基于具有嵌入式光电器件阵列和忆阻交叉开关的可堆叠芯片的可重构集成技术可用于边缘智能应用。