Few researchers have studied high metal ions concentration electroless plating solutions since increasing metal ions concentration shortens the solution life considerably. Nevertheless, as the required thickness of the electroless plating film reduces gradually, the limited solution life will not be a large problem. There are no detailed studies on the influence of high copper concentration electroless copper plating solution and their composition on the plating rate and decomposition time. Therefore, this paper explores the plating characteristics of high copper concentration from a copper‐glycerin complex solution. Taguchi's approach was used to optimize the plating rate and decomposition time based on an L₁₈ orthogonal array with six main effect parameters and three levels. Main effect response tables and plots were employed to investigate the parameter influence. The significant factors of plating rate are temperature and pH, and the concentration of copper sulfate has much influence on the decomposition time. Temperature and copper sulfate concentration are the key factors to optimize the formulation of the plating solution. The optimized results were obtained at 0.18 M copper sulfate, 0.133 M formaldehyde, 0.36 M glycerin, 3.2 × 10⁻⁵ M 2,2’-dipyridyl, 29 °C, pH = 12.8. The copper concentration was more than four times higher than the conventional electroless copper plating solution, and the critical factors of high copper concentration in the electroless copper plating solution were revealed. It was found that copper formed 1:2 complexes with glycerin at a pH value of 12.8. In addition, the surface morphology and the uniformity of the plating layer were included as well.

很少有研究人员研究过高金属离子浓度的化学镀溶液，因为增加金属离子浓度会大大缩短溶液寿命。然而，随着所需的化学镀膜厚度逐渐减小，有限的溶液寿命将不是一个大问题。高铜浓度化学镀铜液及其成分对镀速和分解时间的影响尚无详细研究。因此，本文探讨了铜-甘油络合物溶液中高铜浓度的电镀特性。Taguchi 的方法用于基于 L _{18优化电镀速率和分解时间}具有六个主效应参数和三个水平的正交阵列。使用主效应响应表和图来研究参数影响。电镀速率的重要因素是温度和pH，硫酸铜的浓度对分解时间有很大影响。温度和硫酸铜浓度是优化镀液配方的关键因素。在 0.18 M 硫酸铜、0.133 M 甲醛、0.36 M 甘油、3.2 × 10 ^{-5下获得优化结果} M 2,2'-联吡啶，29 °C，pH = 12.8。铜浓度是常规化学镀铜溶液的四倍以上，揭示了化学镀铜溶液中铜浓度高的关键因素。发现铜在 pH 值为 12.8 时与甘油形成 1:2 的络合物。此外，还包括镀层的表面形态和均匀性。