Heavy metal water pollution is a global concern in recent years. Copper is a toxic metal at higher concentrations (> 20 μg /g) and needs to be removed using ion exchanger systems. This study investigates the removal efficiencies of copper by the non-metallic fraction (NMF) waste printed circuit boards (PCBs). The high maximum adsorption capacity of copper by the PCB-derived material after activation with KOH was 2.65 mmol/g, and the experimental isotherm was best correlated by the Temkin model. Finally, this study presents a novel dual site adsorption/ion exchange mechanism, wherein the potassium (from the activation) and calcium (present in the structure) served as ion exchange sites for the copper in the solution. Therefore, this recycling study, focusing on cyclic environmental management, converts a major waste material to an activated ion exchange resin (high capacity) for the removal of copper from wastewater solutions and successfully regenerates the resin for re-use while producing an acidic copper solution for recovery by electrolysius or chemical salt precipitation.

重金属水污染是近年来全球关注的问题。铜在较高浓度 (> 20 μg /g) 时是一种有毒金属，需要使用离子交换系统去除。本研究调查了非金属部分 (NMF) 废印刷电路板 (PCB) 对铜的去除效率。经 KOH 活化后，PCB 衍生材料对铜的最大吸附量最高为 2.65 mmol/g，实验等温线与 Temkin 模型的相关性最佳。最后，本研究提出了一种新的双位点吸附/离子交换机制，其中钾（来自活化）和钙（存在于结构中）充当溶液中铜的离子交换位点。因此，这项以循环环境管理为重点的回收研究，