The catalytic effect of Pb²⁺ adsorption on gold surface in gold thiosulfate leaching was investigated by electrochemical methods. Open circuit potential (OCP), cyclic voltammetry (CV) and polarization tests showed that 50 and 100 mg/L Pb²⁺ addition to thiosulfate solution increased the OCP from −0.136 V to −0.110 and −0.105 V, respectively, due to adsorbed Pb on the gold surface. The Pb²⁺ addition also increased corrosion rate of gold as well as the anodic current densities. Chronoamperometry was used to determine the interaction between Pb²⁺ and Au during the anodic polarization at −0.1, 0.0, and +0.1 V. A concentration of 100 mg/L Pb²⁺ accelerated the gold oxidation rate relative to the Pb²⁺-free condition, particularly at higher anodic potentials, which resulted in higher dissolved gold concentrations (from near 0 to 2 mg/L). Analysis of the electrode surface with scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy showed that gold oxidation in the thiosulfate solution in the presence of 100 mg/L Pb²⁺ follows a two-step process: (1) formation of an AuPb₂ layer on the gold surface, which improved gold oxidation by inhibiting gold surface passivation; and (2) dissolution of the AuPb₂ layer assisted by the applied anodic potential. Addition of 50 and 100 mg/L Pb²⁺ clearly improved gold oxidation kinetics and efficiency during thiosulfate gold leaching.

^{采用电化学方法研究了硫代硫酸金浸出过程中Pb 2+}对金表面吸附的催化作用。开路电位 (OCP)、循环伏安法 (CV) 和极化测试表明，在硫代硫酸盐溶液中添加 50 和 100 mg/L Pb ²⁺后，OCP 分别从 -0.136 V 增加到 -0.110 和 -0.105 V，因为吸附金表面上的铅。Pb ²⁺添加还增加了金的腐蚀速率以及阳极电流密度。计时电流法用于确定在 -0.1、0.0和 +0.1 V 的阳极极化过程中Pb ^{2+和 Au 之间的相互作用。100 mg/L Pb 2+的浓度相对于 Pb 2+}加速了金的氧化速率- 无条件，特别是在较高的阳极电位下，这导致较高的溶解金浓度（从接近 0 到 2 mg/L）。用扫描电子显微镜、能量色散 X 射线光谱和 X 射线光电子能谱分析电极表面表明，在 100 mg/L Pb ²⁺存在下，硫代硫酸盐溶液中的金氧化遵循两步过程： (1)在金表面形成AuPb ₂层，通过抑制金表面钝化来改善金的氧化；(2)在施加的阳极电位的帮助下，AuPb _{2层的溶解。}添加 50 和 100 mg/L Pb ²⁺明显改善硫代硫酸盐浸金过程中的金氧化动力学和效率。