Abstract The micro-size flake silver powders were prepared through wet-chemical reduction method by using a micro-jet reactor. Herein ascorbic acid was used as a reducing agent, and sulfuric acid was used as a stabilizer. And the lauric acid was used as a dispersing agent to prevent particles’ agglomeration. The micro-jet reactor collides the two solutions together and uniformly mixes outside the reactor, to avoid the problem of clogging in the microchannel. The effects of dispersant addition and micro-jet flow rate on the morphology, particle size, and other parameters of silver powder is investigated in the present work. Interestingly, the addition of dispersant agent and stabilizer have a significant impact on the morphology and parameter of the silver particles. Under the conditions of micro-jet flow rate of 50 mL·min−1, sulfuric acid addition amount of 2%, and lauric acid addition amount of 0.8% by the weight of silver nitrate, a kind of flake silver powders with 4.40–4.70 μm can be prepared. The volume resistivity of the silver paste prepared from the obtained flake silver powders is in the range of 1.4–1.6 × 10−4 Ω·cm−1, which meets the application test requirements of conductive silver paste.

中文翻译：

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微射流反应器制备微米级片状银粉

摘要 采用微射流反应器，采用湿化学还原法制备了微米级片状银粉。这里使用抗坏血酸作为还原剂，使用硫酸作为稳定剂。月桂酸用作分散剂以防止颗粒团聚。微射流反应器将两种溶液碰撞在一起，在反应器外均匀混合，避免了微通道堵塞的问题。本工作研究了分散剂添加量和微射流流速对银粉的形貌、粒径和其他参数的影响。有趣的是，分散剂和稳定剂的添加对银颗粒的形貌和参数有显着影响。在微射流流量为 50 mL·min−1 的条件下，硫酸添加量为2%，月桂酸添加量为硝酸银重量的0.8%，可制得4.40~4.70 μm的片状银粉。所得片状银粉制备的银浆体电阻率在1.4～1.6×10-4 Ω·cm-1范围内，满足导电银浆的应用测试要求。