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On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level 鈥 Part II
IEEE Transactions on Electromagnetic Compatibility ( IF 2.0 ) Pub Date : 5-25-2022 , DOI: 10.1109/temc.2022.3172601
Alexandre Boyer 1 , Nicolas Nolhier 1 , Fabrice Caignet 1 , Sonia Ben Dhia 1
Affiliation  

The work presented in this two-part paper focuses on a prediction method of the radiated susceptibility of integrated circuit and printed circuit board from near-field scan injection, in order to anticipate risks of noncompliance due to design weakness. In Part I, a worst-case estimator of the far-field induced voltage on a PCB trace was proposed. Based on it, an estimator of the radiated susceptibility of a printed circuit board based on near-field scan results is derived and validated through two validation case studies.

中文翻译:


印刷电路板级近场扫描抗扰度与辐射抗扰度之间的相关性──第二部分



这篇由两部分组成的论文中提出的工作重点是近场扫描注入的集成电路和印刷电路板辐射敏感性的预测方法,以预测由于设计缺陷而导致的不合规风险。在第一部分中,提出了 PCB 走线上远场感应电压的最坏情况估计器。在此基础上,通过两个验证案例研究得出并验证了基于近场扫描结果的印刷电路板辐射敏感性估计器。
更新日期:2024-08-28
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