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Characterization of Harmonic Generation by Spring Contacts in Mobile Devices
IEEE Transactions on Electromagnetic Compatibility ( IF 2.0 ) Pub Date : 2022-01-01 , DOI: 10.1109/temc.2022.3174876 Sen Yang 1 , Xiong Chen 2 , Rui Mi 3 , Cheung-Wei Lam 1 , David Pommerenke 4
中文翻译:
移动设备中弹簧触点产生谐波的特征
更新日期:2022-01-01
IEEE Transactions on Electromagnetic Compatibility ( IF 2.0 ) Pub Date : 2022-01-01 , DOI: 10.1109/temc.2022.3174876 Sen Yang 1 , Xiong Chen 2 , Rui Mi 3 , Cheung-Wei Lam 1 , David Pommerenke 4
Affiliation
中文翻译:
移动设备中弹簧触点产生谐波的特征