Securing crypto-cores is becoming increasingly difficult with the advent of electro-magnetic (EM) side-channel analysis (EMSCA) and fault injection attacks (FIAs). This letter presents an Ansys high-frequency structure simulator (HFSS)-based simulation framework for EM analysis of an integrated on-chip sensor for detecting EMSCA and FIA and validates the efficacy of an on-chip higher metal layer loop-based zero area-overhead sensor using a custom-built 65-nm CMOS IC. A simple technique for incoming H-probe detection is also presented by measuring the absolute average of the induced voltage for every encryption.

中文翻译：

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用于侧通道和故障注入攻击检测的集成片上传感环路的电磁分析


随着电磁 (EM) 侧信道分析 (EMSCA) 和故障注入攻击 (FIA) 的出现，保护加密核心的安全变得越来越困难。这封信介绍了基于 Ansys 高频结构模拟器 (HFSS) 的仿真框架，用于对用于检测 EMSCA 和 FIA 的集成片上传感器进行电磁分析，并验证片上基于更高金属层环路的零面积的功效使用定制的 65 nm CMOS IC 的顶置传感器。通过测量每次加密的感应电压的绝对平均值，还提出了一种用于输入 H 探针检测的简单技术。