Grain weathering in grain sorghum [Sorghum bicolor (L.) Moench] is a persistent concern for producers in warm and humid climates. Further, grain sorghum genotypes are known to vary in their response to grain weathering; in some cases, this response is associated with a specific grain trait. For example, waxy endosperm sorghum is perceived to be more susceptible to grain weathering. This study herein compared waxy, heterozygous waxy, and non-waxy sorghum hybrids grown in multiple environments for grain weathering susceptibility and characterization of the fungal communities on the grain. The traits used to evaluate grain weathering included first grain weathering rating (FGWR), area under the disease progress curve (AUDPC), initial germination (IG), and reduction in germination (RIG). Grain weathering intensity varied among the tested environments; increased weathering occurred with wetter conditions. In combined analyses, the environment accounted for more variation (70.2, 38.2, 39.9, and 81.1%) than did genotype (9.0, 26.9, 15.8, and 5.0%) for FGWR, AUDPC, IG, and RIG, respectively. In only one of the four environments were the waxy and heterozygous waxy hybrids statistically different from the non-waxy genotypes. Ultimately, variation was more associated with genotypes than endosperm classes. Overall, Alternaria spp., Bipolaris spp., Fusarium semitectum, Curvularia spp., and Aspergillus niger were the most frequently observed pathogens across environments. Within an environment, the percent of different fungal pathogens remained relatively constant, but varied across environments. There was no clear distinction between either the level of grain weathering or the presence of a particular pathogen and endosperm type. The results indicate that grain sorghums with waxy endosperm are no more susceptible to grain weathering than those with normal, non-waxy endosperm.

中文翻译：

---

比较谷物风化和真菌群落对德克萨斯州种植的蜡质和非蜡质高粱杂交种的影响

谷物高粱 [ Sorghum bicolor (L.) Moench] 的谷物风化是温暖潮湿气候下生产者一直关注的问题。此外，已知谷物高粱基因型对谷物风化的反应各不相同。在某些情况下，这种反应与特定的谷物性状有关。例如，蜡质胚乳高粱被认为更容易受到谷物风化的影响。本文的这项研究比较了蜡质、杂合蜡质和非蜡质在多种环境中生长的高粱杂交种用于谷物风化敏感性和谷物上真菌群落的表征。用于评估谷物风化的性状包括第一粒风化等级（FGWR）、疾病进展曲线下面积（AUDPC）、初始发芽（IG）和发芽减少（RIG）。不同测试环境的颗粒风化强度不同；在潮湿的条件下会增加风化作用。在综合分析中，环境对 FGWR、AUDPC、IG 和 RIG 的影响分别比基因型（9.0、26.9、15.8 和 5.0%）多（70.2%、38.2%、39.9% 和 81.1%）。只有在四种环境中的一种环境中，蜡质和杂合蜡质杂种在统计学上与非蜡质杂交种不同。基因型。最终，变异与基因型的相关性比与胚乳类别的相关性更高。总体而言，链格孢属、双极属、半顶镰孢菌、弯孢属和黑曲霉是在环境中最常观察到的病原体。在一个环境中，不同真菌病原体的百分比保持相对恒定，但因环境而异。谷物风化程度或特定病原体和胚乳类型的存在之间没有明显区别。结果表明，具有蜡质胚乳的谷物高粱并不比那些具有正常、非蜡质胚乳的高粱更容易受到谷物风化的影响。胚乳。