As the request for ready-made food grows, it’s more important than ever to develop effective antimicrobial food packaging materials to assure food’s microbiological safety. The solvent casting method was used to create a chitosan (Cs)/polyvinyl alcohol (PVA) blend based active food packaging material enhanced with Fe₂O₃/TiO₂ (FeTiO₂) nanoparticles. The prepared films were characterized by TEM, XRD, FTIR, and ac conductivity. The structural alterations occurring in the nanocomposites are indicated by FTIR spectra and XRD investigations. The AC conductivity and dielectric characteristics of nanocomposites were dramatically improved as the nanoparticle loading was raised. The mechanical properties of blend/FeTiO2 nanocomposites films were better than pure blend film. The nanocomposites films had good antibacterial activity and mechanical properties, suggesting that they could be a viable alternative to non-biodegradable packaging material.

随着对即食食品需求的增长，开发有效的抗菌食品包装材料以确保食品的微生物安全性比以往任何时候都更加重要。采用溶剂浇铸法制备了基于壳聚糖 (Cs)/聚乙烯醇 (PVA) 共混物的 Fe ₂ O ₃ /TiO ₂ (FeTiO _{2 ) 活性食品包装材料}) 纳米粒子。采用 TEM、XRD、FTIR 和交流电导率对制备的薄膜进行表征。FTIR光谱和XRD研究表明纳米复合材料中发生的结构变化。随着纳米颗粒负载量的增加，纳米复合材料的交流电导率和介电特性显着提高。共混/FeTiO2纳米复合薄膜的力学性能优于纯共混薄膜。纳米复合材料薄膜具有良好的抗菌活性和机械性能，表明它们可以成为不可生物降解的包装材料的可行替代品。