Currently, epoxy-based composites are widely used in thermal management. However, with the development of complex and high power-density electronic devices, the thermal properties of the composites need to be improved. Inspired by the unique galls-leaf structure of Distylium chinense, a graphene-diamond framework (GRDF) is developed by a simple filtration method. A through-plane and in-plane thermal conductivity of 22.7 and 21.8 Wm⁻¹ K⁻¹, respectively, have been achieved by forming epoxy-based composites with the GRDF annealed at 3000 °C. The result is 70% higher than the best-reported value for epoxy-based composites prepared by vacuum filtration under a filler content of 43 wt%. Such high thermal conductivity remains unchanged (within 2%) in a temperature range from 25 to 100 °C. Based on various microscopic characterizations, the diamond particles evenly distribute in a framework formed by graphene sheets, which bridge the gaps in the framework and improve its structural integrity. High-temperature annealing converts most diamond particles to graphite, which further enhances the thermal properties of the composite. The observations provide a feasible way for developing polymer-based composite with high thermal conductivity, which could meet the ever-increasing demands for heat dissipation in high-power electronics.

目前，环氧基复合材料广泛用于热管理。然而，随着复杂和高功率密度电子器件的发展，复合材料的热性能有待提高。受Distylium chinense独特的瘿叶结构的启发，通过简单的过滤方法开发了石墨烯-金刚石框架（GRDF）。^{22.7 和 21.8 Wm -1}  K ^-1的平面和平面热导率分别是通过在 3000°C 下退火的 GRDF 形成环氧基复合材料来实现的。结果比在 43 wt% 填料含量下通过真空过滤制备的环氧基复合材料的最佳报告值高出 70%。如此高的热导率在 25 至 100 °C 的温度范围内保持不变（在 2% 以内）。基于各种微观表征，金刚石颗粒均匀分布在由石墨烯片形成的框架中，从而弥合了框架中的间隙并提高了其结构完整性。高温退火将大多数金刚石颗粒转化为石墨，这进一步增强了复合材料的热性能。这些观察结果为开发具有高导热性的聚合物基复合材料提供了可行的途径，